JPS61205173U - - Google Patents
Info
- Publication number
- JPS61205173U JPS61205173U JP8879385U JP8879385U JPS61205173U JP S61205173 U JPS61205173 U JP S61205173U JP 8879385 U JP8879385 U JP 8879385U JP 8879385 U JP8879385 U JP 8879385U JP S61205173 U JPS61205173 U JP S61205173U
- Authority
- JP
- Japan
- Prior art keywords
- component
- insertion hole
- lead terminal
- conductive pattern
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例の印刷配線基板に電子
部品を半田付けした要部断面図、第２図は従来の
印刷配線基板に電子部品を半田付けした要部断面
図である。
１：絶縁基板、２，３：導体パターン、４：部
品リード端子挿入穴、５：電子部品、６：部品リ
ード端子、７：絶縁体、８：部品外装、９：半田
、１０：貫通穴、１１：ザグリ穴。
FIG. 1 is a cross-sectional view of a main part of an electronic component soldered to a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a main part of a conventional printed wiring board with electronic components soldered thereto. 1: Insulating board, 2, 3: Conductor pattern, 4: Component lead terminal insertion hole, 5: Electronic component, 6: Component lead terminal, 7: Insulator, 8: Component exterior, 9: Solder, 10: Through hole, 11: Countersunk hole.
Claims (1)
刷し、この導体パターンを形成した部品取付面と
導体パターンを形成した半田付面とを貫通する部
品リード端子挿入穴と部品外装接地用貫通穴を明
けた印刷配線基板において、前記部品リード端子
挿入穴の挿入側に挿入穴径より大きい径のザグリ
加工を施したことを特徴とする印刷配線基板。 Conductive patterns are printed on the front and back sides of the insulating board, and a component lead terminal insertion hole and a through hole for component exterior grounding are drilled through the component mounting surface on which the conductive pattern is formed and the soldering surface on which the conductive pattern is formed. 1. A printed wiring board, characterized in that the insertion side of the component lead terminal insertion hole is counterbored with a diameter larger than the diameter of the insertion hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8879385U JPS61205173U (en) | 1985-06-14 | 1985-06-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8879385U JPS61205173U (en) | 1985-06-14 | 1985-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61205173U true JPS61205173U (en) | 1986-12-24 |
Family
ID=30642272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8879385U Pending JPS61205173U (en) | 1985-06-14 | 1985-06-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61205173U (en) |
-
1985
- 1985-06-14 JP JP8879385U patent/JPS61205173U/ja active Pending
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