JPS6448093U - - Google Patents
Info
- Publication number
- JPS6448093U JPS6448093U JP14262687U JP14262687U JPS6448093U JP S6448093 U JPS6448093 U JP S6448093U JP 14262687 U JP14262687 U JP 14262687U JP 14262687 U JP14262687 U JP 14262687U JP S6448093 U JPS6448093 U JP S6448093U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat dissipation
- wiring board
- printed wiring
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
第１図の縦断面図、第３図は従来の電子回路パツ
ケージの放熱構造を示す縦断面図である。
１：印刷配線基板、２：熱伝導板、２ａ：端子
逃げ穴、３：発熱部品、３ａ：端子、４：コネク
タ、４ａ：端子、５：放熱フイン、６，１６：ネ
ジ。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of FIG. 1, and FIG. 3 is a vertical cross-sectional view showing the heat dissipation structure of a conventional electronic circuit package. 1: Printed wiring board, 2: Heat conduction plate, 2a: Terminal escape hole, 3: Heat generating component, 3a: Terminal, 4: Connector, 4a: Terminal, 5: Heat dissipation fin, 6, 16: Screw.
Claims (1)
の端子逃げ穴を設けた熱伝導板を印刷配線基板に
張付け、該熱伝導板面上の一端部に放熱フインを
取付けるとともに、上記端子逃げ穴の位置に合わ
せ上記搭載部品中の発熱部品を上記熱伝導板上に
接触させて搭載したことを特徴とする電子回路パ
ツケージの放熱構造。 A heat conduction plate with terminal relief holes for connecting the terminals of the mounted components to the printed wiring board is pasted on the printed wiring board, a heat dissipation fin is attached to one end of the surface of the heat conduction plate, and a heat dissipation fin is attached to the terminal relief hole. A heat dissipation structure for an electronic circuit package, characterized in that heat-generating components among the mounted components are mounted in contact with the heat conductive plate according to their positions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14262687U JPS6448093U (en) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14262687U JPS6448093U (en) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448093U true JPS6448093U (en) | 1989-03-24 |
Family
ID=31408740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14262687U Pending JPS6448093U (en) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448093U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162497A (en) * | 1990-10-24 | 1992-06-05 | Hitachi Ltd | Cooling device for electronic apparatus |
-
1987
- 1987-09-18 JP JP14262687U patent/JPS6448093U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162497A (en) * | 1990-10-24 | 1992-06-05 | Hitachi Ltd | Cooling device for electronic apparatus |
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