JPS6212991U - - Google Patents
Info
- Publication number
- JPS6212991U JPS6212991U JP1985102695U JP10269585U JPS6212991U JP S6212991 U JPS6212991 U JP S6212991U JP 1985102695 U JP1985102695 U JP 1985102695U JP 10269585 U JP10269585 U JP 10269585U JP S6212991 U JPS6212991 U JP S6212991U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat conductive
- circuit board
- electronic component
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図及び第２図は本考案の実施例を示す縦断
面図、第３図は分解部分斜視図、第４図は本考案
と従来例における熱分布比較図である。
１……発熱性電子部品、１ａ……リード端子、
２……絶縁スリーブ、３……伝熱性金属板、３ａ
……透孔、４，８……伝熱性絶縁シート、５……
プリント基板、５ａ……プリント配線、５ｂ……
スルーホール、６……伝熱性油脂。
1 and 2 are longitudinal sectional views showing an embodiment of the present invention, FIG. 3 is an exploded partial perspective view, and FIG. 4 is a comparison diagram of heat distribution between the present invention and a conventional example. 1... Heat generating electronic component, 1a... Lead terminal,
2... Insulating sleeve, 3... Heat conductive metal plate, 3a
...Through hole, 4,8...Heat conductive insulation sheet, 5...
Printed circuit board, 5a...Printed wiring, 5b...
Through hole, 6...Heat-conductive oil.
Claims (1)
れた透孔を有する伝熱性絶縁シート及び伝熱性金
属板をプリント基板に重ねて貼設し、該伝熱性金
属板上に伝熱性の高い間隙充填材を介在して発熱
性電子部品を載置するとともに、該発熱性電子部
品のリード端子と前記伝熱性金属板とを絶縁して
なることを特徴とする発熱性電子部品実装プリン
ト基板。 A heat conductive insulating sheet and a heat conductive metal plate having through holes drilled corresponding to the through holes of the printed circuit board are laminated and pasted on the printed circuit board, and a gap filler with high heat conductivity is placed on the heat conductive metal plate. 1. A printed circuit board mounted with a heat-generating electronic component, characterized in that a heat-generating electronic component is placed therebetween, and the lead terminals of the heat-generating electronic component are insulated from the heat conductive metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985102695U JPS6212991U (en) | 1985-07-05 | 1985-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985102695U JPS6212991U (en) | 1985-07-05 | 1985-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6212991U true JPS6212991U (en) | 1987-01-26 |
Family
ID=30974569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985102695U Pending JPS6212991U (en) | 1985-07-05 | 1985-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6212991U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04233795A (en) * | 1990-08-03 | 1992-08-21 | Siemens Nixdorf Inf Syst Ag | Electric function unit |
-
1985
- 1985-07-05 JP JP1985102695U patent/JPS6212991U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04233795A (en) * | 1990-08-03 | 1992-08-21 | Siemens Nixdorf Inf Syst Ag | Electric function unit |
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