JPS60133658U - electrical insulation board - Google Patents

electrical insulation board

Info

Publication number
JPS60133658U
JPS60133658U JP2116884U JP2116884U JPS60133658U JP S60133658 U JPS60133658 U JP S60133658U JP 2116884 U JP2116884 U JP 2116884U JP 2116884 U JP2116884 U JP 2116884U JP S60133658 U JPS60133658 U JP S60133658U
Authority
JP
Japan
Prior art keywords
insulation board
electrical insulation
conductive layer
heat dissipation
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2116884U
Other languages
Japanese (ja)
Inventor
秀明 白井
博 石橋
石井　昭弘
伊藤　弘孝
葛下　弘和
吉岡　道彦
Original Assignee
三菱電線工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電線工業株式会社 filed Critical 三菱電線工業株式会社
Priority to JP2116884U priority Critical patent/JPS60133658U/en
Publication of JPS60133658U publication Critical patent/JPS60133658U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の電気絶縁基板を示す。図において口ま
導電層便は絶縁層、３は放熱用金属板　　　、である。 　　　　　□　　　　　　　　　　　　　　。FIG. 1 shows an electrically insulating substrate of the present invention. In the figure, the conductive layer is an insulating layer, and 3 is a metal plate for heat dissipation. □.

Claims (1)

【実用新案登録請求の範囲】 、　　　導電層、絶縁層及び放熱用金属板からなる電気
絶縁基板において、導電層として銅めっきアルミ箔を使
用し姓トを特徴とスる電気絶縁基板。 ７　　、゛　　　　−、パ、[Scope of Claim for Utility Model Registration] An electrically insulating board consisting of a conductive layer, an insulating layer, and a metal plate for heat dissipation, characterized by using copper-plated aluminum foil as the conductive layer. 7,゛-,pa,
JP2116884U 1984-02-15 1984-02-15 electrical insulation board Pending JPS60133658U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2116884U JPS60133658U (en) 1984-02-15 1984-02-15 electrical insulation board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2116884U JPS60133658U (en) 1984-02-15 1984-02-15 electrical insulation board

Publications (1)

Publication Number Publication Date
JPS60133658U true JPS60133658U (en) 1985-09-06

Family

ID=30512316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2116884U Pending JPS60133658U (en) 1984-02-15 1984-02-15 electrical insulation board

Country Status (1)

Country Link
JP (1) JPS60133658U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013069910A (en) * 2011-09-22 2013-04-18 Shindengen Electric Mfg Co Ltd Semiconductor device
JP2013256039A (en) * 2012-06-12 2013-12-26 Risho Kogyo Co Ltd Laminated sheet and prepreg used for the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013069910A (en) * 2011-09-22 2013-04-18 Shindengen Electric Mfg Co Ltd Semiconductor device
JP2013256039A (en) * 2012-06-12 2013-12-26 Risho Kogyo Co Ltd Laminated sheet and prepreg used for the same

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