JPS58138395U - insulation fin - Google Patents
insulation finInfo
- Publication number
- JPS58138395U JPS58138395U JP3326582U JP3326582U JPS58138395U JP S58138395 U JPS58138395 U JP S58138395U JP 3326582 U JP3326582 U JP 3326582U JP 3326582 U JP3326582 U JP 3326582U JP S58138395 U JPS58138395 U JP S58138395U
- Authority
- JP
- Japan
- Prior art keywords
- heat conductive
- high heat
- fin
- insulation fin
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Insulating Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図、第2図は、本考案の実施例の概略断面図、第3
図は、第1図に電子材料搭載用アルミニウムブロックを
接合した概略断面図を示す。
符号、1・・・フィン、2・・・金属板、3・・・高熱
伝導電気絶縁樹脂、4・・・高熱伝導接着剤、5・・・
高熱伝導ペースト、6・・・接合ネジ、7・・・電子材
料塔載用アルミニウムブロック。1 and 2 are schematic sectional views of an embodiment of the present invention, and FIG.
The figure shows a schematic cross-sectional view of the aluminum block for mounting electronic materials bonded to FIG. 1. Code, 1...Fin, 2...Metal plate, 3...High heat conductive electrical insulating resin, 4...High heat conductive adhesive, 5...
High thermal conductivity paste, 6... Joining screw, 7... Aluminum block for mounting electronic materials.
Claims (1)
剤、金属板及び高熱伝導電気絶縁樹脂を順次積層したこ
とを特徴とする絶縁フィン。An insulating fin characterized by sequentially laminating a high heat conductive paste or a high heat conductive adhesive, a metal plate, and a high heat conductive electric insulating resin on the top surface of the fin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3326582U JPS58138395U (en) | 1982-03-11 | 1982-03-11 | insulation fin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3326582U JPS58138395U (en) | 1982-03-11 | 1982-03-11 | insulation fin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58138395U true JPS58138395U (en) | 1983-09-17 |
Family
ID=30044818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3326582U Pending JPS58138395U (en) | 1982-03-11 | 1982-03-11 | insulation fin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58138395U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5645060A (en) * | 1979-09-21 | 1981-04-24 | Hitachi Ltd | Semiconductor device |
-
1982
- 1982-03-11 JP JP3326582U patent/JPS58138395U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5645060A (en) * | 1979-09-21 | 1981-04-24 | Hitachi Ltd | Semiconductor device |
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