JPS592150U - Isolated semiconductor device for power use - Google Patents
Isolated semiconductor device for power useInfo
- Publication number
- JPS592150U JPS592150U JP9757682U JP9757682U JPS592150U JP S592150 U JPS592150 U JP S592150U JP 9757682 U JP9757682 U JP 9757682U JP 9757682 U JP9757682 U JP 9757682U JP S592150 U JPS592150 U JP S592150U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat sink
- insulating plate
- power use
- electrode system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、本考案にて言及されている電力用絶縁型半導
体装置例の側面図を示し、また第２図は、従来構造品の
断面図を示す。第３図、第４図は本考案の実施例の断面
図を示す。
なお図において、１・・・放熱板、２・・・絶縁用セラ
ミック板、３・・・電極系銅板、４・・・半導体素子、
５・・・本考案による緩衝用銅板、６・・・外装ケース
、７・・・電極を示す。FIG. 1 shows a side view of an example of an insulated power semiconductor device referred to in the present invention, and FIG. 2 shows a sectional view of a conventional structure. 3 and 4 show cross-sectional views of embodiments of the present invention. In the figure, 1... Heat sink, 2... Insulating ceramic plate, 3... Electrode system copper plate, 4... Semiconductor element,
5... Buffer copper plate according to the present invention, 6... Exterior case, 7... Electrode.
Claims (1)
電極系を支持する、熱法導良好な放熱板を有し、該放熱
板と該半導体素子及び電極系とを電気的に絶縁する絶縁
板を有する、絶縁型半導体装置において、該絶縁板と放
熱板間もしくは、該絶縁板と半導体素子及び電極系間に
、該放熱板とほぼ同じ厚さを有し、該絶縁板とほぼ何し
大きさを有する銅板を半田付けした事を特徴とする、電
力用絶縁型半導体装置。It has one or more semiconductor elements, has a heat sink with good thermal conductivity that supports the semiconductor element and the electrode system, and electrically insulates the heat sink from the semiconductor element and the electrode system. In an insulated semiconductor device having an insulating plate, there is a space between the insulating plate and the heat sink, or between the insulating plate and the semiconductor element and the electrode system, which has approximately the same thickness as the heat sink and has approximately the same thickness as the insulating plate. An insulated semiconductor device for power use, characterized by soldering a copper plate having a size of 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9757682U JPS592150U (en) | 1982-06-29 | 1982-06-29 | Isolated semiconductor device for power use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9757682U JPS592150U (en) | 1982-06-29 | 1982-06-29 | Isolated semiconductor device for power use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS592150U true JPS592150U (en) | 1984-01-09 |
Family
ID=30232042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9757682U Pending JPS592150U (en) | 1982-06-29 | 1982-06-29 | Isolated semiconductor device for power use |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS592150U (en) |
-
1982
- 1982-06-29 JP JP9757682U patent/JPS592150U/en active Pending
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