JPS5944052U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5944052U JPS5944052U JP13920282U JP13920282U JPS5944052U JP S5944052 U JPS5944052 U JP S5944052U JP 13920282 U JP13920282 U JP 13920282U JP 13920282 U JP13920282 U JP 13920282U JP S5944052 U JPS5944052 U JP S5944052U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- semiconductor equipment
- semiconductor chip
- contact
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置を示す断面図、第２図も従来
の半導体装置を示す断面図、第３図はこの考案の一実施
例による半導体装置を示す断面図である。
１・・・半導体チップ、２・・・セラミック基板、３・
・・バンプ、４・・・リード、５・・・印刷配線板、６
・・・ヒートシンク、７・・・ハンダ、８・・・スペー
サ、１０・・・ばね、１２・・・ふた状部材、１３・・
・熱伝導率の良い気体。なお、図中、同一符号は同一、
又は相当部分を示す。FIG. 1 is a sectional view showing a conventional semiconductor device, FIG. 2 is a sectional view also showing a conventional semiconductor device, and FIG. 3 is a sectional view showing a semiconductor device according to an embodiment of the invention. 1... Semiconductor chip, 2... Ceramic substrate, 3...
...Bump, 4...Lead, 5...Printed wiring board, 6
... Heat sink, 7... Solder, 8... Spacer, 10... Spring, 12... Lid-shaped member, 13...
・Gas with good thermal conductivity. In addition, in the figure, the same reference numerals are the same,
or a corresponding portion.
Claims (1)
た状の部材で半導体チップに接触しないように覆い、該
部材をセラミック基板に機械的な圧力により押しつける
ことにより、セラミック基板と該部材との熱的な接触を
保つことを特徴とする半導体装置。The semiconductor chip mounted on the ceramic substrate is covered with a hollow lid-like member so as not to come into contact with the semiconductor chip, and the member is pressed against the ceramic substrate with mechanical pressure, thereby reducing the thermal relationship between the ceramic substrate and the member. A semiconductor device characterized by maintaining good contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13920282U JPS5944052U (en) | 1982-09-14 | 1982-09-14 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13920282U JPS5944052U (en) | 1982-09-14 | 1982-09-14 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5944052U true JPS5944052U (en) | 1984-03-23 |
Family
ID=30312081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13920282U Pending JPS5944052U (en) | 1982-09-14 | 1982-09-14 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5944052U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61133649A (en) * | 1984-12-03 | 1986-06-20 | Mitsubishi Electric Corp | Semiconductor device |
-
1982
- 1982-09-14 JP JP13920282U patent/JPS5944052U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61133649A (en) * | 1984-12-03 | 1986-06-20 | Mitsubishi Electric Corp | Semiconductor device |
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