JPS5868041U - circuit package - Google Patents
circuit packageInfo
- Publication number
- JPS5868041U JPS5868041U JP16108781U JP16108781U JPS5868041U JP S5868041 U JPS5868041 U JP S5868041U JP 16108781 U JP16108781 U JP 16108781U JP 16108781 U JP16108781 U JP 16108781U JP S5868041 U JPS5868041 U JP S5868041U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- thermally conductive
- heat generating
- generating element
- circuit package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は基板にキャップを取りつけた本考案の装置の断
面図、第２図は平行平板シートを用いたときの従来の部
分拡大断面図である。
１０・・・半導体素子、１１・・・半田、２０・・・配
線基板、３０・・・熱伝導性キャップ、３１・・・熱伝
導性シート、４０・・・冷却液。FIG. 1 is a sectional view of the device of the present invention in which a cap is attached to a substrate, and FIG. 2 is a partially enlarged sectional view of a conventional device using a parallel flat sheet. DESCRIPTION OF SYMBOLS 10... Semiconductor element, 11... Solder, 20... Wiring board, 30... Heat conductive cap, 31... Heat conductive sheet, 40... Coolant.
Claims (1)
上記基板と共に格納容器を形成する熱伝導性キャップと
、上記キャップ表面と上記熱発生素子表面との間に配置
された軟質で変形可能な熱伝導性シートと、上記熱伝導
性シートを上記両表面に密着するように圧力を加え変形
させる手段を有し、上記熱発生素子で発生した熱を熱伝
導により上記熱伝導性キャップへ導くことを可能としだ
回路パッケージ。a substrate that supports a thermophotogenic element; a thermally conductive cap that covers the heat generating element and forms a containment vessel together with the substrate; and a soft and deformable cap disposed between the surface of the cap and the surface of the heat generating element. and a means for applying pressure and deforming the thermally conductive sheet so as to bring it into close contact with both surfaces, the heat generated by the heat generating element is transferred to the thermally conductive cap by thermal conduction. A circuit package that makes it possible to
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16108781U JPS5868041U (en) | 1981-10-30 | 1981-10-30 | circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16108781U JPS5868041U (en) | 1981-10-30 | 1981-10-30 | circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5868041U true JPS5868041U (en) | 1983-05-09 |
Family
ID=29953469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16108781U Pending JPS5868041U (en) | 1981-10-30 | 1981-10-30 | circuit package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5868041U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63266898A (en) * | 1987-04-24 | 1988-11-02 | Hitachi Ltd | Cooling structure of printed-circuit board |
-
1981
- 1981-10-30 JP JP16108781U patent/JPS5868041U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63266898A (en) * | 1987-04-24 | 1988-11-02 | Hitachi Ltd | Cooling structure of printed-circuit board |
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