JPS58189593U - circuit element assembly - Google Patents
circuit element assemblyInfo
- Publication number
- JPS58189593U JPS58189593U JP8844382U JP8844382U JPS58189593U JP S58189593 U JPS58189593 U JP S58189593U JP 8844382 U JP8844382 U JP 8844382U JP 8844382 U JP8844382 U JP 8844382U JP S58189593 U JPS58189593 U JP S58189593U
- Authority
- JP
- Japan
- Prior art keywords
- circuit element
- element assembly
- resistor
- semiconductor element
- insulating coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案に係る回路素子集合体の一実施例を示す
正面図、第2図は同側面図である。
1・・・放熱器(冷却フィン)、2・・・絶縁層(絶縁
コーティング)、3及び4・・・抵抗器、5〜7・・・
半導体素子、8〜10・・・取付ブロック、11及び1
2・・・端子ブロック、13・・・枠体。FIG. 1 is a front view showing one embodiment of a circuit element assembly according to the present invention, and FIG. 2 is a side view of the same. 1... Heat sink (cooling fin), 2... Insulating layer (insulating coating), 3 and 4... Resistor, 5-7...
Semiconductor elements, 8 to 10...Mounting blocks, 11 and 1
2...Terminal block, 13...Frame body.
Claims (2)
この面に抵抗器を直接、また半導体素子を取付ブロック
を介してそれぞれ取付けたことを特徴とする回路素子集
合体。(1) Apply an insulating coating to one predetermined side of the heatsink,
A circuit element assembly characterized in that a resistor is mounted directly on this surface and a semiconductor element is mounted via a mounting block.
た実用新案登録請求の範囲第1項記載の回路素子集合体
。(2) The circuit element assembly according to claim 1, wherein the resistor is arranged in the upper half and the semiconductor element is arranged in the lower half.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8844382U JPS58189593U (en) | 1982-06-14 | 1982-06-14 | circuit element assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8844382U JPS58189593U (en) | 1982-06-14 | 1982-06-14 | circuit element assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58189593U true JPS58189593U (en) | 1983-12-16 |
Family
ID=30097114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8844382U Pending JPS58189593U (en) | 1982-06-14 | 1982-06-14 | circuit element assembly |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58189593U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014116402A (en) * | 2012-12-07 | 2014-06-26 | Kansai Electric Power Co Inc:The | Automatic voltage regulator |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5143730U (en) * | 1974-09-30 | 1976-03-31 | ||
JPS5638464B2 (en) * | 1972-03-21 | 1981-09-07 |
-
1982
- 1982-06-14 JP JP8844382U patent/JPS58189593U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5638464B2 (en) * | 1972-03-21 | 1981-09-07 | ||
JPS5143730U (en) * | 1974-09-30 | 1976-03-31 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014116402A (en) * | 2012-12-07 | 2014-06-26 | Kansai Electric Power Co Inc:The | Automatic voltage regulator |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS58189593U (en) | circuit element assembly | |
JPS5822746U (en) | semiconductor equipment | |
JPS6042742U (en) | semiconductor equipment | |
JPS5929048U (en) | Heatsink mounting structure for semiconductor components | |
JPS6096842U (en) | electronic equipment | |
JPS6022846U (en) | hybrid integrated circuit | |
JPS6037248U (en) | hybrid integrated circuit | |
JPS59121892U (en) | heat dissipation device | |
JPS602841U (en) | semiconductor mounting board | |
JPS587337U (en) | Hybrid integrated circuit device | |
JPS6018549U (en) | IC pellet | |
JPS58120664U (en) | heat dissipation fin | |
JPS60109332U (en) | Hybrid integrated circuit device | |
JPS6134750U (en) | semiconductor equipment | |
JPS5818351U (en) | Semiconductor device cooling equipment | |
JPS59149639U (en) | Transistor holding device | |
JPS58166048U (en) | IC package | |
JPS6025153U (en) | cooling fins | |
JPS6176998U (en) | ||
JPS6078142U (en) | integrated circuit device | |
JPS5944052U (en) | semiconductor equipment | |
JPS61174775U (en) | ||
JPS6134742U (en) | integrated circuit | |
JPS59177957U (en) | radiator | |
JPS5926258U (en) | Heat dissipation device for semiconductor devices |