JPS6096842U - electronic equipment - Google Patents
electronic equipmentInfo
- Publication number
- JPS6096842U JPS6096842U JP18949283U JP18949283U JPS6096842U JP S6096842 U JPS6096842 U JP S6096842U JP 18949283 U JP18949283 U JP 18949283U JP 18949283 U JP18949283 U JP 18949283U JP S6096842 U JPS6096842 U JP S6096842U
- Authority
- JP
- Japan
- Prior art keywords
- chassis
- electronic equipment
- electronic device
- heat
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来例の平面図、第２図は従来例の正面図、
第３図は、本考案の具体的実施例の平面図、第４図は、
本考案の具体的実施例の正面図である。
１：シャーシ、２：発熱部品、３：伝導コンパウンド、
４：放熱フィン、５：取付ネジ、６・７：プリント基板
、８：スタッド（スペーサー）。Figure 1 is a plan view of the conventional example, Figure 2 is a front view of the conventional example,
FIG. 3 is a plan view of a specific embodiment of the present invention, and FIG. 4 is a plan view of a specific embodiment of the present invention.
FIG. 2 is a front view of a specific embodiment of the present invention. 1: Chassis, 2: Heat generating parts, 3: Conductive compound,
4: Radiation fin, 5: Mounting screw, 6/7: Printed circuit board, 8: Stud (spacer).
Claims (1)
らを保持するシャーシとを備える電子装置において、シ
ャーシを導電性を有し熱伝導性に秀れた部材で構成する
とともに、該シャーシに発熱する電子部品と、放熱フィ
ンとをそれぞれ直接固着してなることを特徴とする電子
装置。In an electronic device that includes electronic components that generate heat, heat dissipation fins, and a chassis that holds them, the chassis is made of a material that is electrically conductive and has excellent thermal conductivity, and the chassis is An electronic device characterized in that an electronic component and a heat radiation fin are directly fixed to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18949283U JPS6096842U (en) | 1983-12-07 | 1983-12-07 | electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18949283U JPS6096842U (en) | 1983-12-07 | 1983-12-07 | electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6096842U true JPS6096842U (en) | 1985-07-02 |
| JPS6339976Y2 JPS6339976Y2 (en) | 1988-10-19 |
Family
ID=30408534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18949283U Granted JPS6096842U (en) | 1983-12-07 | 1983-12-07 | electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6096842U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007144590A (en) * | 2005-11-29 | 2007-06-14 | Seiko Epson Corp | Robot control device |
| JP2012227374A (en) * | 2011-04-20 | 2012-11-15 | Mitsubishi Electric Corp | Heat radiation structure of electronic apparatus |
| JP2018056585A (en) * | 2010-07-16 | 2018-04-05 | エンブレーション リミテッドＥｍｂｌａｔｉｏｎ Ｌｉｍｉｔｅｄ | Device and method for taking thermal interface |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4529537Y1 (en) * | 1966-11-15 | 1970-11-13 |
-
1983
- 1983-12-07 JP JP18949283U patent/JPS6096842U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4529537Y1 (en) * | 1966-11-15 | 1970-11-13 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007144590A (en) * | 2005-11-29 | 2007-06-14 | Seiko Epson Corp | Robot control device |
| JP4670611B2 (en) * | 2005-11-29 | 2011-04-13 | セイコーエプソン株式会社 | Robot controller |
| JP2018056585A (en) * | 2010-07-16 | 2018-04-05 | エンブレーション リミテッドＥｍｂｌａｔｉｏｎ Ｌｉｍｉｔｅｄ | Device and method for taking thermal interface |
| JP2012227374A (en) * | 2011-04-20 | 2012-11-15 | Mitsubishi Electric Corp | Heat radiation structure of electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6339976Y2 (en) | 1988-10-19 |
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