JPS59132643U - Cooling system - Google Patents
Cooling systemInfo
- Publication number
- JPS59132643U JPS59132643U JP2574483U JP2574483U JPS59132643U JP S59132643 U JPS59132643 U JP S59132643U JP 2574483 U JP2574483 U JP 2574483U JP 2574483 U JP2574483 U JP 2574483U JP S59132643 U JPS59132643 U JP S59132643U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- mounting plate
- heat pipe
- cooling device
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体の冷却装置を示す斜視図、第２図
は本考案に係る冷却装置を示す斜視図である。
１．７・・・半導体、２・・・ヒートシンク、３．５・
・・プリント基板、４・・・ファン、６・・・半導体取
付板、９・・・絶縁シート、１０・・・ヒートパイプ、
１１・・・押え部品、１３・・・固定金具、１５・・・
ヒートバイブ取付板、１６・・・半導体冷却器、１７・
・・冷却側、１８・・・発熱側、２０・・・シャーシ。FIG. 1 is a perspective view showing a conventional semiconductor cooling device, and FIG. 2 is a perspective view showing a cooling device according to the present invention. 1.7...Semiconductor, 2...Heat sink, 3.5.
...Printed circuit board, 4...Fan, 6...Semiconductor mounting plate, 9...Insulating sheet, 10...Heat pipe,
11... Holding part, 13... Fixing metal fittings, 15...
Heat vibrator mounting plate, 16... semiconductor cooler, 17.
...Cooling side, 18... Heat generation side, 20... Chassis.
Claims (3)
一端を押え部品を介して装着し、該ヒートパイプの他端
をヒートパイプ取付板を介して半導体冷却器の冷却側に
装着し、該半導体冷却器の発熱側をシャーシに固設した
ことを特徴とする冷却装置。(1) Attach one end of the heat pipe to the semiconductor mounting plate on which the semiconductor is fixed via a holding part, and attach the other end of the heat pipe to the cooling side of the semiconductor cooler via the heat pipe mounting plate. A cooling device characterized in that the heat generating side of a semiconductor cooler is fixed to a chassis.
に絶縁された熱的接続であることを特徴とする実用新案
登録請求の範囲第１項記載の冷却装置。(2) The cooling device according to claim 1, wherein the connection between the semiconductor mounting plate and the heat pipe is an electrically insulated thermal connection.
との接続は熱抵抗の小さい接着剤を用いたことを特徴と
する実用新案登録請求の範囲第１項記載の冷却装置。(3) The cooling device according to claim 1, wherein the heat vibrator mounting plate and the cooling side of the semiconductor cooler are connected using an adhesive having low thermal resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2574483U JPS59132643U (en) | 1983-02-25 | 1983-02-25 | Cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2574483U JPS59132643U (en) | 1983-02-25 | 1983-02-25 | Cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59132643U true JPS59132643U (en) | 1984-09-05 |
Family
ID=30156717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2574483U Pending JPS59132643U (en) | 1983-02-25 | 1983-02-25 | Cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59132643U (en) |
-
1983
- 1983-02-25 JP JP2574483U patent/JPS59132643U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59132643U (en) | Cooling system | |
| JPS5827997U (en) | Heat dissipation structure of electronic equipment | |
| JPS6096842U (en) | electronic equipment | |
| JPS6134744U (en) | Cooling equipment for electronic equipment | |
| JPS5995690U (en) | Automotive control circuit unit | |
| JPS58166049U (en) | Heat dissipation structure of hybrid IC | |
| JPS5974695U (en) | induction heating device | |
| JPS60119795U (en) | Heating element cooling device | |
| JPS6076059U (en) | Printed board | |
| JPS5929048U (en) | Heatsink mounting structure for semiconductor components | |
| JPS59173346U (en) | heat dissipation device | |
| JPS5860943U (en) | Cooling device for electronic parts | |
| JPS58166089U (en) | printed wiring board equipment | |
| JPS59185840U (en) | electronic equipment | |
| JPS59177959U (en) | semiconductor heat sink | |
| JPS6083253U (en) | radiator | |
| JPS59146981U (en) | small circuit module | |
| JPS58135994U (en) | Auxiliary heat sink | |
| JPS59128742U (en) | Heating element mounting device | |
| JPS59103450U (en) | circuit unit | |
| JPS59121847U (en) | semiconductor equipment | |
| JPS6071195U (en) | Heat dissipation device in printed circuit board | |
| JPS58155897U (en) | printed wiring device | |
| JPS60169846U (en) | Inverter device | |
| JPS58127651U (en) | heat dissipation device |