JPS5929048U - Heatsink mounting structure for semiconductor components - Google Patents
Heatsink mounting structure for semiconductor componentsInfo
- Publication number
- JPS5929048U JPS5929048U JP12220082U JP12220082U JPS5929048U JP S5929048 U JPS5929048 U JP S5929048U JP 12220082 U JP12220082 U JP 12220082U JP 12220082 U JP12220082 U JP 12220082U JP S5929048 U JPS5929048 U JP S5929048U
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- heatsink
- semiconductor components
- heatsink mounting
- semiconductor component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体部品の放熱器取付構造の一例を示
す分解斜視図、第２図は従来の取付構造の他の例を示す
分解斜視−１第３図は第２図の取付構造を示す側面図、
第４図は本考案に係る半導体部品の放熱器取付構造の一
実施例を示す分解斜視図、第５図は第４図の取付構造を
示す側面図、第６図は本考案に係る取付構造の他の実施
例を示す斜視図、第７図は第６図の取付構造を示す側面
図、第８図は本考案に係る取付構造め更に他の実施例を
示す側面図、第９図は第８図の取付構造における一取付
手段を示す斜視図、第１０図は第８図の取付構造におけ
乞他の取付手段を示す斜視図、第１１図は本考案に係る
取付構造の更に他の実施例を示す斜視図、第１２図は第
１１図の取付構造を示す側面図である。
図中、１は半導体部品、２は放熱器、７は電気絶縁被膜
、１１は接着剤である。Fig. 1 is an exploded perspective view showing an example of a conventional heatsink mounting structure for semiconductor components, and Fig. 2 is an exploded perspective view showing another example of the conventional mounting structure. Fig. 3 shows the mounting structure of Fig. 2. Side view showing,
FIG. 4 is an exploded perspective view showing an embodiment of a heat sink mounting structure for semiconductor components according to the present invention, FIG. 5 is a side view showing the mounting structure of FIG. 4, and FIG. 6 is a mounting structure according to the present invention. 7 is a side view showing the mounting structure of FIG. 6, FIG. 8 is a side view showing another embodiment of the mounting structure according to the present invention, and FIG. 9 is a side view showing another embodiment of the mounting structure according to the present invention. FIG. 10 is a perspective view showing another mounting means in the mounting structure of FIG. 8, and FIG. 11 is a perspective view of another mounting structure according to the present invention. FIG. 12 is a side view showing the mounting structure of FIG. 11. In the figure, 1 is a semiconductor component, 2 is a heat sink, 7 is an electrical insulation coating, and 11 is an adhesive.
Claims (1)
取付構造において、該放熱器の半導体部品取付面に電気
絶縁被膜を塗布し、該被膜上に半導体部品を接着剤で接
着固定したことを特徴とする半導体部品の放熱器取付構
造。A heatsink mounting structure for attaching a semiconductor component to a heatsink for heat dissipation, characterized in that an electrically insulating coating is applied to the semiconductor component mounting surface of the heatsink, and the semiconductor component is bonded and fixed onto the coating using an adhesive. Heatsink mounting structure for semiconductor components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12220082U JPS5929048U (en) | 1982-08-13 | 1982-08-13 | Heatsink mounting structure for semiconductor components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12220082U JPS5929048U (en) | 1982-08-13 | 1982-08-13 | Heatsink mounting structure for semiconductor components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5929048U true JPS5929048U (en) | 1984-02-23 |
Family
ID=30279407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12220082U Pending JPS5929048U (en) | 1982-08-13 | 1982-08-13 | Heatsink mounting structure for semiconductor components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5929048U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56157221U (en) * | 1980-04-23 | 1981-11-24 | ||
| JPS61224499A (en) * | 1985-03-29 | 1986-10-06 | 富士通株式会社 | Cooling construction |
-
1982
- 1982-08-13 JP JP12220082U patent/JPS5929048U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56157221U (en) * | 1980-04-23 | 1981-11-24 | ||
| JPS61224499A (en) * | 1985-03-29 | 1986-10-06 | 富士通株式会社 | Cooling construction |
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