JPS58120664U - heat dissipation fin - Google Patents
heat dissipation finInfo
- Publication number
- JPS58120664U JPS58120664U JP1671382U JP1671382U JPS58120664U JP S58120664 U JPS58120664 U JP S58120664U JP 1671382 U JP1671382 U JP 1671382U JP 1671382 U JP1671382 U JP 1671382U JP S58120664 U JPS58120664 U JP S58120664U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- ceramic substrate
- unevenness
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図は本考案による放熱フィンの構造を示す側面図である
。
に）面において、１はセラミック基板、２は放熱フィン
、３は電子部品をそれぞれ示す。The figure is a side view showing the structure of a heat dissipation fin according to the present invention. 2), 1 is a ceramic substrate, 2 is a heat dissipation fin, and 3 is an electronic component.
Claims (1)
、該電子部品の放熱を行う放熱フィンであって、前記セ
ラミック基板の部品搭載面の反対面に凹凸を設けるとと
もに該凹凸に密接する凸凹を形成した熱伝導体からなる
放熱金属フィンと前記セラミック基板とで１体構成した
ことを特徴とする放熱フィン。 、A heat dissipation fin for mounting an electronic component in contact with a ceramic substrate and dissipating heat from the electronic component, wherein an uneven surface is provided on a surface opposite to the component mounting surface of the ceramic substrate, and unevenness is formed in close contact with the unevenness. A heat dissipation fin comprising a heat dissipation metal fin made of a thermal conductor and the ceramic substrate. ,
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1671382U JPS58120664U (en) | 1982-02-08 | 1982-02-08 | heat dissipation fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1671382U JPS58120664U (en) | 1982-02-08 | 1982-02-08 | heat dissipation fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58120664U true JPS58120664U (en) | 1983-08-17 |
Family
ID=30029072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1671382U Pending JPS58120664U (en) | 1982-02-08 | 1982-02-08 | heat dissipation fin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58120664U (en) |
-
1982
- 1982-02-08 JP JP1671382U patent/JPS58120664U/en active Pending
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