JPS60163738U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS60163738U
JPS60163738U JP1984050356U JP5035684U JPS60163738U JP S60163738 U JPS60163738 U JP S60163738U JP 1984050356 U JP1984050356 U JP 1984050356U JP 5035684 U JP5035684 U JP 5035684U JP S60163738 U JPS60163738 U JP S60163738U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
heat sink
solder
semiconductor device
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984050356U
Other languages
Japanese (ja)
Inventor
磯山　貴久雄
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP1984050356U priority Critical patent/JPS60163738U/en
Publication of JPS60163738U publication Critical patent/JPS60163738U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図および第２図は従来の半導体装置を説明する断面
図、第３図は本考案の半導体装置を説明する断面図、第
４図は本考案に用いるヒートシンクを説明する上面図で
ある。 １１は固着基板、１２はヒートシンク、１３はパワー半
導体素子、１４は半田層、１５は凹部である。　　　　
　　　　、1 and 2 are cross-sectional views illustrating a conventional semiconductor device, FIG. 3 is a sectional view illustrating a semiconductor device of the present invention, and FIG. 4 is a top view illustrating a heat sink used in the present invention. 11 is a fixed substrate, 12 is a heat sink, 13 is a power semiconductor element, 14 is a solder layer, and 15 is a recessed portion.
,

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 固着基板上に熱伝導性良好なヒートシンクを介してパワ
ー半導体素子を半田で固着する半導体装置に於いて、前
記ヒートシンクのパワー半導体素子の四角に対応する部
分に凹部を設は半田の厚みを他より厚く形成することを
特徴とする半導体装置。In a semiconductor device in which a power semiconductor element is fixed with solder on a fixed substrate via a heat sink with good thermal conductivity, a recess is provided in a portion of the heat sink corresponding to the square of the power semiconductor element, so that the thickness of the solder is smaller than that of the other part. A semiconductor device characterized by being formed thickly.
JP1984050356U 1984-04-05 1984-04-05 semiconductor equipment Pending JPS60163738U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984050356U JPS60163738U (en) 1984-04-05 1984-04-05 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984050356U JPS60163738U (en) 1984-04-05 1984-04-05 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS60163738U true JPS60163738U (en) 1985-10-30

Family

ID=30568409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984050356U Pending JPS60163738U (en) 1984-04-05 1984-04-05 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS60163738U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013123016A (en) * 2011-12-12 2013-06-20 Denso Corp Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138243A (en) * 1979-04-13 1980-10-28 Mitsubishi Electric Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138243A (en) * 1979-04-13 1980-10-28 Mitsubishi Electric Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013123016A (en) * 2011-12-12 2013-06-20 Denso Corp Semiconductor device

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