JPS60103860U - semiconductor laser equipment - Google Patents

semiconductor laser equipment

Info

Publication number
JPS60103860U
JPS60103860U JP19780883U JP19780883U JPS60103860U JP S60103860 U JPS60103860 U JP S60103860U JP 19780883 U JP19780883 U JP 19780883U JP 19780883 U JP19780883 U JP 19780883U JP S60103860 U JPS60103860 U JP S60103860U
Authority
JP
Japan
Prior art keywords
semiconductor laser
laser equipment
electrode
solder
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19780883U
Other languages
Japanese (ja)
Inventor
野島 正信
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP19780883U priority Critical patent/JPS60103860U/en
Publication of JPS60103860U publication Critical patent/JPS60103860U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来例を示す断面図、第2図は本考案の実施例
を示す断面図である。 11・・・半導体レーザチップ、12・・・Siサブマ
ウント、13・・・第1電極、14・・・第2電極、1
5・・・Inハンダ、16・・・Sn層、17・・・ヒ
ートシンク、18・・・金層、19・・・In −Sn
ハンダ。
FIG. 1 is a sectional view showing a conventional example, and FIG. 2 is a sectional view showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 11... Semiconductor laser chip, 12... Si submount, 13... First electrode, 14... Second electrode, 1
5...In solder, 16...Sn layer, 17...heat sink, 18...gold layer, 19...In-Sn
Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体レーザチップ、−主面に第1電極が形成され、該
第1電極にInハンダを用いて上記チップが固着された
Siサブマウント、該別サブマウントの他主面に形成さ
れ7’、zAuからなるオーミック性の第2電極上に積
層されたSn層、該Sn層がIn−3nハンダを用いて
固着されたヒートシンクを具備したことを特徴とする半
導体レーザ装置。
A semiconductor laser chip, a Si submount having a first electrode formed on its main surface, the chip being fixed to the first electrode using In solder, and another submount formed on the other main surface of the semiconductor laser chip; What is claimed is: 1. A semiconductor laser device comprising: an Sn layer laminated on an ohmic second electrode, and a heat sink to which the Sn layer is fixed using In-3n solder.
JP19780883U 1983-12-21 1983-12-21 semiconductor laser equipment Pending JPS60103860U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19780883U JPS60103860U (en) 1983-12-21 1983-12-21 semiconductor laser equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19780883U JPS60103860U (en) 1983-12-21 1983-12-21 semiconductor laser equipment

Publications (1)

Publication Number Publication Date
JPS60103860U true JPS60103860U (en) 1985-07-15

Family

ID=30423315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19780883U Pending JPS60103860U (en) 1983-12-21 1983-12-21 semiconductor laser equipment

Country Status (1)

Country Link
JP (1) JPS60103860U (en)

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