JPS59146970U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS59146970U
JPS59146970U JP4111783U JP4111783U JPS59146970U JP S59146970 U JPS59146970 U JP S59146970U JP 4111783 U JP4111783 U JP 4111783U JP 4111783 U JP4111783 U JP 4111783U JP S59146970 U JPS59146970 U JP S59146970U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
thin film
semiconductor chip
header
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4111783U
Other languages
Japanese (ja)
Inventor
久雄 佐々木
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP4111783U priority Critical patent/JPS59146970U/en
Publication of JPS59146970U publication Critical patent/JPS59146970U/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の砒化ガリウムトランジスタの部分断面図
、第2図は本考案の一実施例の部分断面図である。 1・・・・・・砒化ガリウムトランジスタチップ、2・
・・・・・ヒートシンクと一体なヘッダ、3・・・・・
・ソルダ、4・・・・・・金薄膜。
FIG. 1 is a partial sectional view of a conventional gallium arsenide transistor, and FIG. 2 is a partial sectional view of an embodiment of the present invention. 1... Gallium arsenide transistor chip, 2.
...Header integrated with heat sink, 3...
・Solder, 4... Gold thin film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ヒートシンクと1体に形成されたヘッダと半導体チップ
との間に金等のやわらかい金属の薄膜を挿入し、前記ヘ
ッダと半導体チップと金属薄膜とをソルダーで接続した
ことを特徴とする半導体装置。
A semiconductor device characterized in that a thin film of a soft metal such as gold is inserted between a header formed integrally with a heat sink and a semiconductor chip, and the header, the semiconductor chip, and the metal thin film are connected by solder.
JP4111783U 1983-03-22 1983-03-22 semiconductor equipment Pending JPS59146970U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4111783U JPS59146970U (en) 1983-03-22 1983-03-22 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4111783U JPS59146970U (en) 1983-03-22 1983-03-22 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS59146970U true JPS59146970U (en) 1984-10-01

Family

ID=30171714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4111783U Pending JPS59146970U (en) 1983-03-22 1983-03-22 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS59146970U (en)

Similar Documents

Publication Publication Date Title
JPS59146970U (en) semiconductor equipment
JPS59107157U (en) GaAs semiconductor device
JPS58195444U (en) semiconductor equipment
JPS5844842U (en) semiconductor equipment
JPS5923748U (en) semiconductor parts
JPS60103860U (en) semiconductor laser equipment
JPS5858347U (en) semiconductor equipment
JPS5999447U (en) Package for semiconductors
JPS58116241U (en) semiconductor equipment
JPS6068656U (en) Semiconductor device with heat sink
JPS6094835U (en) semiconductor equipment
JPS5889946U (en) semiconductor equipment
JPS59111097U (en) semiconductor equipment
JPS5978632U (en) semiconductor equipment
JPS5996845U (en) semiconductor equipment
JPS6094834U (en) semiconductor equipment
JPS58168135U (en) semiconductor equipment
JPS59109151U (en) Resin-encapsulated semiconductor device
JPS60103859U (en) heat sink electrode
JPS6073249U (en) Resin-encapsulated semiconductor device
JPS58433U (en) semiconductor equipment
JPS60113642U (en) semiconductor equipment
JPS60194361U (en) semiconductor laser equipment
JPS5877048U (en) semiconductor equipment
JPS59159952U (en) heat sink structure