JPS59146970U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS59146970U JPS59146970U JP4111783U JP4111783U JPS59146970U JP S59146970 U JPS59146970 U JP S59146970U JP 4111783 U JP4111783 U JP 4111783U JP 4111783 U JP4111783 U JP 4111783U JP S59146970 U JPS59146970 U JP S59146970U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- thin film
- semiconductor chip
- header
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の砒化ガリウムトランジスタの部分断面図
、第２図は本考案の一実施例の部分断面図である。
１・・・・・・砒化ガリウムトランジスタチップ、２・
・・・・・ヒートシンクと一体なヘッダ、３・・・・・
・ソルダ、４・・・・・・金薄膜。FIG. 1 is a partial sectional view of a conventional gallium arsenide transistor, and FIG. 2 is a partial sectional view of an embodiment of the present invention. 1... Gallium arsenide transistor chip, 2.
...Header integrated with heat sink, 3...
・Solder, 4... Gold thin film.
Claims (1)
との間に金等のやわらかい金属の薄膜を挿入し、前記ヘ
ッダと半導体チップと金属薄膜とをソルダーで接続した
ことを特徴とする半導体装置。A semiconductor device characterized in that a thin film of a soft metal such as gold is inserted between a header formed integrally with a heat sink and a semiconductor chip, and the header, the semiconductor chip, and the metal thin film are connected by solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4111783U JPS59146970U (en) | 1983-03-22 | 1983-03-22 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4111783U JPS59146970U (en) | 1983-03-22 | 1983-03-22 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59146970U true JPS59146970U (en) | 1984-10-01 |
Family
ID=30171714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4111783U Pending JPS59146970U (en) | 1983-03-22 | 1983-03-22 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59146970U (en) |
-
1983
- 1983-03-22 JP JP4111783U patent/JPS59146970U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59146970U (en) | semiconductor equipment | |
| JPS59107157U (en) | GaAs semiconductor device | |
| JPS58195444U (en) | semiconductor equipment | |
| JPS5844842U (en) | semiconductor equipment | |
| JPS5923748U (en) | semiconductor parts | |
| JPS60103860U (en) | semiconductor laser equipment | |
| JPS5858347U (en) | semiconductor equipment | |
| JPS5999447U (en) | Package for semiconductors | |
| JPS58116241U (en) | semiconductor equipment | |
| JPS6068656U (en) | Semiconductor device with heat sink | |
| JPS6094835U (en) | semiconductor equipment | |
| JPS5889946U (en) | semiconductor equipment | |
| JPS59111097U (en) | semiconductor equipment | |
| JPS5978632U (en) | semiconductor equipment | |
| JPS5996845U (en) | semiconductor equipment | |
| JPS6094834U (en) | semiconductor equipment | |
| JPS58168135U (en) | semiconductor equipment | |
| JPS59109151U (en) | Resin-encapsulated semiconductor device | |
| JPS60103859U (en) | heat sink electrode | |
| JPS6073249U (en) | Resin-encapsulated semiconductor device | |
| JPS58433U (en) | semiconductor equipment | |
| JPS60113642U (en) | semiconductor equipment | |
| JPS60194361U (en) | semiconductor laser equipment | |
| JPS5877048U (en) | semiconductor equipment | |
| JPS59159952U (en) | heat sink structure |