JPS6066040U - heat sink - Google Patents

heat sink

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Publication number
JPS6066040U
JPS6066040U JP15878383U JP15878383U JPS6066040U JP S6066040 U JPS6066040 U JP S6066040U JP 15878383 U JP15878383 U JP 15878383U JP 15878383 U JP15878383 U JP 15878383U JP S6066040 U JPS6066040 U JP S6066040U
Authority
JP
Japan
Prior art keywords
heat sink
chip
mounting
recorded
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15878383U
Other languages
Japanese (ja)
Inventor
木村 義成
篤史 村上
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP15878383U priority Critical patent/JPS6066040U/en
Publication of JPS6066040U publication Critical patent/JPS6066040U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の半導体装置の断面図である。 1・・・・・・半導体チップ、2・・・・・・蒸着半田
、3・・・・・・ヒートシンク。 第2図は本考案の一実施例によるヒートシンクを用いた
半導体装置の断面図である。 11・・・・・・半導体トップ、12・・・・・・蒸着
半田、12・・・・・・ヒートシンク。
FIG. 1 is a sectional view of a conventional semiconductor device. 1...Semiconductor chip, 2...Vaporized solder, 3...Heat sink. FIG. 2 is a sectional view of a semiconductor device using a heat sink according to an embodiment of the present invention. 11...Semiconductor top, 12...Vaporized solder, 12...Heat sink.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップをマウントするヒートシンクに於いて、マ
ウント面に前記チップと同面積の凸形状突部を有するこ
とを特徴とするヒートシンク。
A heat sink for mounting a semiconductor chip, characterized in that the mounting surface has a convex protrusion having the same area as the chip.
JP15878383U 1983-10-14 1983-10-14 heat sink Pending JPS6066040U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15878383U JPS6066040U (en) 1983-10-14 1983-10-14 heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15878383U JPS6066040U (en) 1983-10-14 1983-10-14 heat sink

Publications (1)

Publication Number Publication Date
JPS6066040U true JPS6066040U (en) 1985-05-10

Family

ID=30349705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15878383U Pending JPS6066040U (en) 1983-10-14 1983-10-14 heat sink

Country Status (1)

Country Link
JP (1) JPS6066040U (en)

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