JPS587350U - Cooling structure for lead type semiconductor devices - Google Patents
Cooling structure for lead type semiconductor devicesInfo
- Publication number
- JPS587350U JPS587350U JP10062881U JP10062881U JPS587350U JP S587350 U JPS587350 U JP S587350U JP 10062881 U JP10062881 U JP 10062881U JP 10062881 U JP10062881 U JP 10062881U JP S587350 U JPS587350 U JP S587350U
- Authority
- JP
- Japan
- Prior art keywords
- type semiconductor
- cooling structure
- semiconductor devices
- lead type
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の冷却構造の系統図、第２図は従来の冷却
構造の断面図、第３〜第５図は本考案の冷却構造の断面
図である。
１・・・・・・リードタイプ素子、２・・・・・・リー
ドタイプリード線、３・・・・・・金属放熱体、４・・
・・・・プリント基 。
板。FIG. 1 is a system diagram of a conventional cooling structure, FIG. 2 is a sectional view of the conventional cooling structure, and FIGS. 3 to 5 are sectional views of the cooling structure of the present invention. 1...Lead type element, 2...Lead type lead wire, 3...Metal heat sink, 4...
...Print base. Board.
Claims (1)
けたことを特徴とするリードタイプ半導体素子の冷却構
造。A cooling structure for a lead-type semiconductor device, characterized in that a cooling piece is provided in a lead wire portion of the lead-type semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10062881U JPS587350U (en) | 1981-07-08 | 1981-07-08 | Cooling structure for lead type semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10062881U JPS587350U (en) | 1981-07-08 | 1981-07-08 | Cooling structure for lead type semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS587350U true JPS587350U (en) | 1983-01-18 |
Family
ID=29895312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10062881U Pending JPS587350U (en) | 1981-07-08 | 1981-07-08 | Cooling structure for lead type semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS587350U (en) |
-
1981
- 1981-07-08 JP JP10062881U patent/JPS587350U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS587350U (en) | Cooling structure for lead type semiconductor devices | |
| JPS6094834U (en) | semiconductor equipment | |
| JPS59119039U (en) | Heat dissipation structure for semiconductor devices | |
| JPS59107157U (en) | GaAs semiconductor device | |
| JPS5844842U (en) | semiconductor equipment | |
| JPS602841U (en) | semiconductor mounting board | |
| JPS59186688U (en) | Heat exchanger | |
| JPS59159952U (en) | heat sink structure | |
| JPS59145055U (en) | Heat sink for semiconductor laser | |
| JPS5878676U (en) | Ceramic wiring device | |
| JPS5895648U (en) | radiator | |
| JPS5812938U (en) | semiconductor wafer | |
| JPS60113642U (en) | semiconductor equipment | |
| JPS6057194U (en) | Metal case sealed electronic equipment | |
| JPS58109258U (en) | Heat sink for transistor mounting | |
| JPS60181048U (en) | Lead frame for semiconductor devices | |
| JPS6061740U (en) | Hybrid integrated circuit device | |
| JPS58135957U (en) | semiconductor equipment | |
| JPS60185344U (en) | semiconductor equipment | |
| JPS5878637U (en) | semiconductor equipment | |
| JPS59115656U (en) | transistor case | |
| JPS6063980U (en) | Chip carrier package structure | |
| JPS58159750U (en) | semiconductor equipment | |
| JPS5897845U (en) | Power IC mounting structure | |
| JPS5870095U (en) | Thyristor protection device |