JPS5878676U - Ceramic wiring device - Google Patents
Ceramic wiring deviceInfo
- Publication number
- JPS5878676U JPS5878676U JP17317781U JP17317781U JPS5878676U JP S5878676 U JPS5878676 U JP S5878676U JP 17317781 U JP17317781 U JP 17317781U JP 17317781 U JP17317781 U JP 17317781U JP S5878676 U JPS5878676 U JP S5878676U
- Authority
- JP
- Japan
- Prior art keywords
- wiring device
- ceramic wiring
- wiring pattern
- wiring
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のライトペンを示す図、第２図は本考案に
よるライトペンを示す図、第３図は本考案の別の実施例
を示す側面図である。
図において、１０．１６はセラミック製の構造物、１１
．１７は平坦面、１２・・・は回路部品、１８はフィン
である。FIG. 1 is a diagram showing a conventional light pen, FIG. 2 is a diagram showing a light pen according to the present invention, and FIG. 3 is a side view showing another embodiment of the present invention. In the figure, 10.16 is a ceramic structure, 11
．． 17 is a flat surface, 12... are circuit components, and 18 is a fin.
Claims (1)
坦面を形成して、該平坦面に厚膜の配線パターンを設け
１、該配線パターンに直接回路部品を接続すると共に、
セラミック製構造物に部品搭載と配線及び放熱の機能を
兼ねさせたことを特徴とするセラミック配線装置。Forming a flat surface for providing a wiring pattern on a ceramic structure, providing a thick film wiring pattern on the flat surface 1, connecting circuit components directly to the wiring pattern,
A ceramic wiring device characterized in that a ceramic structure has the functions of mounting components, wiring, and heat radiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17317781U JPS5878676U (en) | 1981-11-20 | 1981-11-20 | Ceramic wiring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17317781U JPS5878676U (en) | 1981-11-20 | 1981-11-20 | Ceramic wiring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5878676U true JPS5878676U (en) | 1983-05-27 |
Family
ID=29965041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17317781U Pending JPS5878676U (en) | 1981-11-20 | 1981-11-20 | Ceramic wiring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5878676U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011125344A1 (en) * | 2010-04-06 | 2011-10-13 | 株式会社アテクト | Substrate and method for manufacturing substrate |
-
1981
- 1981-11-20 JP JP17317781U patent/JPS5878676U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011125344A1 (en) * | 2010-04-06 | 2011-10-13 | 株式会社アテクト | Substrate and method for manufacturing substrate |
| JP2011222624A (en) * | 2010-04-06 | 2011-11-04 | Atect Corp | Substrate and method for manufacturing the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5878676U (en) | Ceramic wiring device | |
| JPS587396U (en) | Circuit board for heat generating parts | |
| JPS6112262U (en) | Ceramic substrate for printed wiring board | |
| JPS59119039U (en) | Heat dissipation structure for semiconductor devices | |
| JPS58155897U (en) | printed wiring device | |
| JPS5978647U (en) | Printed board | |
| JPS602841U (en) | semiconductor mounting board | |
| JPS5963462U (en) | ceramic wiring board | |
| JPS596899U (en) | multilayer printed board | |
| JPS5885341U (en) | printed circuit board | |
| JPS58175668U (en) | printed wiring board | |
| JPS5858327U (en) | chip parts | |
| JPS5917441U (en) | photo mask | |
| JPS5961547U (en) | thick film circuit board | |
| JPS5874346U (en) | integrated circuit module | |
| JPS6022846U (en) | hybrid integrated circuit | |
| JPS5834795U (en) | Printed circuit board cooling device | |
| JPS59138259U (en) | Manufacturing method of printed circuit board with heatsink | |
| JPS59103488U (en) | Printed board | |
| JPS58114047U (en) | Semiconductor device mounting structure | |
| JPS6061740U (en) | Hybrid integrated circuit device | |
| JPS5936257U (en) | heat dissipation device | |
| JPS587350U (en) | Cooling structure for lead type semiconductor devices | |
| JPS5839049U (en) | Chippukiyariya | |
| JPS58153453U (en) | heat sink |