JPS5936257U - heat dissipation device - Google Patents
heat dissipation deviceInfo
- Publication number
- JPS5936257U JPS5936257U JP9489583U JP9489583U JPS5936257U JP S5936257 U JPS5936257 U JP S5936257U JP 9489583 U JP9489583 U JP 9489583U JP 9489583 U JP9489583 U JP 9489583U JP S5936257 U JPS5936257 U JP S5936257U
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- dissipation device
- heat
- heat dissipation
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の放熱装置の概略図、第２図は第１図の詳
細図、第３図は第１図のＡ−Ａ’゛断面図、第４図は本
案の放熱装置の概略図、第５図は第４図のＢ−Ｂ’断面
図である。Fig. 1 is a schematic diagram of a conventional heat dissipation device, Fig. 2 is a detailed diagram of Fig. 1, Fig. 3 is a sectional view taken along line AA' in Fig. 1, and Fig. 4 is a schematic diagram of the heat dissipation device of the present invention. , FIG. 5 is a sectional view taken along line BB' in FIG. 4.
Claims (1)
する電子部品をはめ込んで使用するものにおいて、電子
部品とソケットとの間にヒートパイプを介在させ、かつ
各ソケットの上面にヒートパイプの下面が密着する凹部
を形成し、一方、ヒートパイプの上面を、電子部品の下
側面に密着する形状とし、電子部品から発生する熱を、
ヒートパイプを介して除去するようにした放熱装置。In devices where electronic components with lead pins are fitted into multiple sockets on a printed circuit board, a heat pipe is interposed between the electronic component and the socket, and the bottom surface of the heat pipe is in close contact with the top surface of each socket. On the other hand, the upper surface of the heat pipe is shaped to be in close contact with the lower surface of the electronic component, and the heat generated from the electronic component is
A heat dissipation device that removes heat through a heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9489583U JPS5936257U (en) | 1983-06-22 | 1983-06-22 | heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9489583U JPS5936257U (en) | 1983-06-22 | 1983-06-22 | heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5936257U true JPS5936257U (en) | 1984-03-07 |
Family
ID=30226898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9489583U Pending JPS5936257U (en) | 1983-06-22 | 1983-06-22 | heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5936257U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6263993U (en) * | 1985-10-09 | 1987-04-21 |
-
1983
- 1983-06-22 JP JP9489583U patent/JPS5936257U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6263993U (en) * | 1985-10-09 | 1987-04-21 |
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