JPS58109258U - Heat sink for transistor mounting - Google Patents
Heat sink for transistor mountingInfo
- Publication number
- JPS58109258U JPS58109258U JP546782U JP546782U JPS58109258U JP S58109258 U JPS58109258 U JP S58109258U JP 546782 U JP546782 U JP 546782U JP 546782 U JP546782 U JP 546782U JP S58109258 U JPS58109258 U JP S58109258U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- transistor
- transistor mounting
- mounting
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、従来のトランジスタ取り付は用放熱板を示す
斜視図、第2図は、本考案の一実施例によるトランジス
タ取り付は放熱板を示す斜視図である。
1・・・・・・放熱板、2,2′・・・・・・突起部、
3・・・・・・トランジスタ、4・・・・・・取り付は
部、5・・・・・・ねじ穴、7・・・・・・取り付は孔
。FIG. 1 is a perspective view of a conventional heat sink for mounting a transistor, and FIG. 2 is a perspective view of a heat sink for mounting a transistor according to an embodiment of the present invention. 1... Heat sink, 2, 2'... Protrusion,
3...Transistor, 4...Mounting via hole, 5...Screw hole, 7...Mounting via hole.
Claims (1)
起部を設け、該突起部をトランジスタ取り付は部の孔に
挿入して該孔を介して上記突起部の上記ねじ穴にねじを
螺合してトランジスタを上□記放熱板に取り付けるよう
に構成したことを特徴とするトランジスタ取り付は用放
熱板。For transistor mounting, a protrusion with a screw hole is provided on the side of the heat sink, and the protrusion is inserted into the hole in the transistor mounting part, and a screw is screwed into the screw hole of the protrusion through the hole. A heat sink for mounting a transistor, characterized in that the transistor is attached to the heat sink as described above.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP546782U JPS58109258U (en) | 1982-01-18 | 1982-01-18 | Heat sink for transistor mounting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP546782U JPS58109258U (en) | 1982-01-18 | 1982-01-18 | Heat sink for transistor mounting |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58109258U true JPS58109258U (en) | 1983-07-25 |
Family
ID=30018269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP546782U Pending JPS58109258U (en) | 1982-01-18 | 1982-01-18 | Heat sink for transistor mounting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58109258U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04116149U (en) * | 1991-03-28 | 1992-10-16 | 株式会社ケンウツド | Heat dissipation structure of electronic devices |
-
1982
- 1982-01-18 JP JP546782U patent/JPS58109258U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04116149U (en) * | 1991-03-28 | 1992-10-16 | 株式会社ケンウツド | Heat dissipation structure of electronic devices |
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