JPH04116149U - Heat dissipation structure of electronic devices - Google Patents

Abstract

(57) [Summary] [Purpose] To bring an electronic device into close contact with a heat sink,
The objective is to realize a heat dissipation structure for electronic devices that improves heat dissipation efficiency. [Structure] Since the corner 1a of the power transistor 1 does not hit the curved part due to the notch 3, the power transistor 1 is completely in close contact with the two surfaces 2A and 2B of the heat sink 2.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to a heat dissipation structure for electronic devices.

0002

[Prior art]

A conventional technique is shown in FIG.

0003 In the figure, 1 is a power transistor, and 2 is a This is a heat dissipation plate bent into an L-shape so that the

0004 However, the bent portion 2a of the heat sink 2 bent into an L shape is bent with a certain radius. , the corner 1a of the power transistor 1 hits the bending part 2a, and therefore the power transistor There was a problem in that the resistor 1 did not come into complete contact with the heat sink 2.

[0005] Also, if there is a burr (not shown) on the corner 1a of the power transistor 1, In addition to the above problem, power transistor 1 is subjected to stress during assembly. There was also the problem that it would get damaged.

[0006]

[Problem that the idea aims to solve]

This idea was made in view of the above points, and its purpose is to , an electronic device that brings the electronic device into close contact with a heat sink, thereby improving heat dissipation efficiency. The purpose is to provide a heat dissipation structure for chairs.

[0007]

[Means to solve the problem]

The heat dissipation structure of electronic devices of this invention is suitable for electronic devices such as power transistors. and a bent part bent in an L-shape so as to be in close contact with two surfaces of the electronic device. In the heat dissipation structure for an electronic device, the heat dissipation structure includes a heat dissipation plate, the heat dissipation plate having the bent portion A cutout is provided, and the electronic device is attached to the heat sink so as to cover the cutout. It is assembled into.

[0008]

【Example】

An example of the heat dissipation structure of an electronic device according to this invention will be explained based on FIGS. 1 to 3. do.

[0009] Note that the same parts as in the conventional example are given the same reference numerals, and the explanation thereof will be omitted.

0010 In the figure, 3 is a roughly rectangular shape provided on the heat sink 2 to escape the corner 1a of the power transistor 1. It is a notch in the shape.

[0011] The width dimension 3A of the notch portion 3 is larger than the width dimension 1A of the power transistor 1. , Also, the height dimension of the notch part 3B is smaller than the height dimension 1B of the power transistor. The dimensions of each are determined.

0012 In addition, 4 stops the rotation of the power transistor 1, and 5 releases the power transistor 1. The screws 6 are fixed to the heat plate 2, and the screws 6 are the screws for assembling the power transistor 1 and the heat sink 2. It is a lint board.

[0013] In the heat dissipation structure of an electronic device configured in this way, the power transistor Since the corner 1a of 1 does not hit the curved bend 2a due to the notch 3, the power transformer The resistor 1 is completely in close contact with the two surfaces 2A and 2B of the heat sink 2.

[0014] Note that the power transistor 1 may be another element, such as a three-terminal regulator, etc. You can.

[0015]

[Effect of the idea]

According to the heat dissipation structure of an electronic device according to this invention, since it is configured as described above, It has the following effects. Electronic devices can be used without being affected by the shape of the electronic device or the precision of the heat sink. The mounting accuracy of the base can be improved. Since electronic devices are structured to be in close contact with the heat sink, the heat dissipation effect is improved and , there will be no damage to parts.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a heat dissipation structure for an electronic device according to the present invention.

FIG. 2 is a diagram showing a state in which the electronic device is assembled to a heat sink.

FIG. 3 is a sectional view of the main part.

FIG. 4 is a cross-sectional view of the prior art.

[Explanation of symbols]

1 Power transistor 2 Heat sink 2a Bend part 3 Notch

Claims (1)

[Scope of utility model registration request] 1. A heat dissipation structure for an electronic device comprising an electronic device such as a power transistor, and a heat dissipation plate having an L-shaped bent part so as to be in close contact with two surfaces of the electronic device, wherein the heat dissipation plate A heat dissipation structure for an electronic device, characterized in that a notch is provided in the bent portion, and the electronic device is assembled to the heat sink so as to cover the notch.