JP2597784Y2 - Heat dissipation structure of electronic device - Google Patents
Heat dissipation structure of electronic deviceInfo
- Publication number
- JP2597784Y2 JP2597784Y2 JP1991027374U JP2737491U JP2597784Y2 JP 2597784 Y2 JP2597784 Y2 JP 2597784Y2 JP 1991027374 U JP1991027374 U JP 1991027374U JP 2737491 U JP2737491 U JP 2737491U JP 2597784 Y2 JP2597784 Y2 JP 2597784Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- power transistor
- heat dissipation
- dissipation structure
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この考案は電子デバイスの放熱構
造に関する。BACKGROUND OF THE INVENTION This invention relates to a heat dissipation structure for an electronic device.
【０００２】[0002]
【従来技術】従来技術を図４に示す。2. Description of the Related Art FIG.
【０００３】図において、１はパワートランジスタ、２
はパワートランジスタ１の２面に密着する様にＬ字状に
屈曲せしめた放熱板である。In the figure, 1 is a power transistor, 2
Is a heat sink bent in an L-shape so as to be in close contact with the two surfaces of the power transistor 1.
【０００４】しかし、Ｌ字状に曲げた放熱板２の屈曲部
2aはある半径を持ち曲げられているから、パワートラン
ジスタ１の角1aが屈曲部2aに当たり、このため、パワー
トランジスタ１が放熱板２に完全に密着しないという問
題を有していた。However, the bent portion of the heat sink 2 bent in an L-shape
Since 2a is bent with a certain radius, the corner 1a of the power transistor 1 hits the bent portion 2a, which has a problem that the power transistor 1 does not completely adhere to the heat sink 2.
【０００５】また、パワートランジスタ１の角1aにバリ
（図示していない）がある様な場合には、上記問題に加
えて、組み付けの際、パワートランジスタ１がストレス
のために破損するという問題もあった。In the case where there is a burr (not shown) at the corner 1a of the power transistor 1, in addition to the above problem, there is also a problem that the power transistor 1 is damaged due to stress during assembly. there were.
【０００６】[0006]
【考案が解決しようとする課題】この考案は上記した点
に鑑みてなされたものであり、その目的とするところ
は、電子デバイスを放熱板に密着させ、以って、放熱効
率を向上せしめる電子デバイスの放熱構造を提供するこ
とにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to provide an electronic device in which an electronic device is brought into close contact with a heat radiating plate, thereby improving heat radiation efficiency. An object of the present invention is to provide a heat dissipation structure of a device.
【０００７】[0007]
【課題を解決するための手段】この考案の電子デバイス
の放熱構造は、パワートランジスタ等の電子デバイス
（１）と、電子デバイス（１）の所定面に密着する面
（２Ａ）と、電子デバイス（１）の他の所定面に密着す
る面（２Ｂ）と、面（２Ａ）と面（２Ｂ）の接合部であ
るＬ字状に屈曲した屈曲部（２ａ）とを有する放熱板
（２）とからなる電子デバイスの放熱構造において、面
（２Ｂ）に電子デバイス（１）の面（２Ｂ）に接する幅
より長い形状を有する切欠部（３）を屈曲部（２ａ）を
切り欠くように設け、切欠部（３）に位置するように電
子デバイス（１）を放熱板（２）に組み付けたものであ
る。The heat radiating structure of the electronic device according to the present invention includes an electronic device (1) such as a power transistor, a surface (2A) which is in close contact with a predetermined surface of the electronic device (1), and an electronic device (1). 1) a heat radiating plate (2) having a surface (2B) that is in intimate contact with another predetermined surface and an L-shaped bent portion (2a) that is a joint between the surface (2A) and the surface (2B). A notch (3) having a shape longer than a width in contact with the surface (2B) of the electronic device (1) is provided on the surface (2B) so as to cut off the bent portion (2a); The electronic device (1) is assembled to a heat sink (2) so as to be located in the notch (3).
【０００８】[0008]
【実施例】この考案に係る電子デバイスの放熱構造の実
施例を図１乃至図３に基づき説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a heat radiation structure for an electronic device according to the present invention will be described with reference to FIGS.
【０００９】なお、従来例と同一部分には同一符号を付
してその説明を省略する。The same parts as those in the conventional example are denoted by the same reference numerals, and description thereof will be omitted.
【００１０】図中、３はパワートランジスタ１の角1aを
逃げるため放熱板２に設けた略長方形の切欠部である。In the figure, reference numeral 3 denotes a substantially rectangular cutout provided on the heat sink 2 to escape the corner 1a of the power transistor 1.
【００１１】そして、切欠部３の幅寸法3Aはパワートラ
ンジスタ１の幅寸法1Aより大であり、また、切欠部の高
さ寸法3Bはパワートランジスタの高さ寸法1Bより小とな
る様に、それぞれの寸法が決められている。The width 3A of the notch 3 is larger than the width 1A of the power transistor 1, and the height 3B of the notch is smaller than the height 1B of the power transistor. The dimensions of are determined.
【００１２】また、４はパワートランジスタ１の回転止
め、５はパワートランジスタ１を放熱板２に固定するね
じ、６はパワートランジスタ１と放熱板２とを組み付け
るプリント基板である。Reference numeral 4 denotes a rotation stopper for the power transistor 1, reference numeral 5 denotes a screw for fixing the power transistor 1 to the radiator plate 2, and reference numeral 6 denotes a printed circuit board on which the power transistor 1 and the radiator plate 2 are assembled.
【００１３】このように構成した電子デバイスの放熱構
造においては、パワートランジスタ１の角１ａは切欠部
３のために湾曲した屈曲部２ａに当たらないから、パワ
ートランジスタ１は放熱板２の２つの面２Ａ及び２Ｂに
完全に密着する。また、放熱器の板厚の係わらず、同様
の効果を奏することができる。更に、放熱器の湾曲した
屈曲部２ａにも影響を受けない。In the heat dissipation structure of the electronic device configured as described above, since the corner 1a of the power transistor 1 does not hit the curved portion 2a which is curved due to the cutout 3, the power transistor 1 is provided on the two surfaces of the heat dissipation plate 2. Completely adheres to 2A and 2B. Further, the same effect can be obtained regardless of the thickness of the radiator. Furthermore, it is not affected by the curved bent portion 2a of the radiator.
【００１４】なお、パワートランジスタ１は他の素子、
例えば、三端子レギュレータ等であってもよい。The power transistor 1 is composed of another element,
For example, a three-terminal regulator may be used.
【００１５】[0015]
【考案の効果】この考案に係る電子デバイスの放熱構造
によれば、上述の様に構成したので、以下の効果を有す
る。 電子デバイスの形状の形態や放熱板の工作精度
の影響を受けずに電子デバイスの取付精度を高めること
ができる。 放熱板の板厚の影響を受けずに電子デバ
イスの取付精度を高めることができる。 電子デバイ
スは放熱器と２つの面で密着する構造であるから、放熱
効果も向上する。 電子デバイスは放熱器の湾曲した
屈曲部の影響を受けずに取付可能となる。According to the heat dissipating structure for an electronic device of the present invention, the structure described above has the following effects. The mounting accuracy of the electronic device can be increased without being affected by the shape of the electronic device or the working accuracy of the heat sink. The mounting accuracy of the electronic device can be improved without being affected by the thickness of the heat sink. Since the electronic device has a structure in which it is in close contact with the radiator on two sides, the heat radiation effect is also improved. The electronic device can be mounted without being affected by the curved portion of the radiator.
【図１】この考案の電子デバイスの放熱構造の実施例を
示す分解斜視図である。FIG. 1 is an exploded perspective view showing an embodiment of a heat dissipation structure of an electronic device of the present invention.
【図２】同電子デバイスを放熱板に組み付けた状態を示
す図である。FIG. 2 is a diagram showing a state where the electronic device is assembled to a heat sink.
【図３】同要部の断面図である。FIG. 3 is a sectional view of the main part.
【図４】従来技術の断面図である。FIG. 4 is a sectional view of the prior art.
１ パワートランジスタ ２ 放熱板 2a 屈曲部 ３ 切欠部 DESCRIPTION OF SYMBOLS 1 Power transistor 2 Heat sink 2a Bent part 3 Notch
Claims (1)
（１）と、電子デバイス（１）の所定面に密着する面
（２Ａ）と、電子デバイス（１）の他の所定面に密着す
る面（２Ｂ）と、面（２Ａ）と面（２Ｂ）の接合部であ
るＬ字状に屈曲した屈曲部（２ａ）とを有する放熱板
（２）とからなる電子デバイスの放熱構造において、面
（２Ｂ）に電子デバイス（１）の面（２Ｂ）に接する幅
より長い形状を有する切欠部（３）を屈曲部（２ａ）を
切り欠くように設け、切欠部（３）に位置するように電
子デバイス（１）を放熱板（２）に組み付けたことを特
徴とする電子デバイスの放熱構造。An electronic device (1) such as a power transistor, a surface (2A) that is in close contact with a predetermined surface of the electronic device (1), and a surface (2B) that is in close contact with another predetermined surface of the electronic device (1). And a heat radiating plate (2) having an L-shaped bent portion (2a) which is a joint between the surface (2A) and the surface (2B). A notch (3) having a shape longer than the width in contact with the surface (2B) of the electronic device (1) is provided so as to cut the bent portion (2a), and the electronic device (1) is positioned at the notch (3). ) Is assembled to the heat radiating plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991027374U JP2597784Y2 (en) | 1991-03-28 | 1991-03-28 | Heat dissipation structure of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991027374U JP2597784Y2 (en) | 1991-03-28 | 1991-03-28 | Heat dissipation structure of electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04116149U JPH04116149U (en) | 1992-10-16 |
| JP2597784Y2 true JP2597784Y2 (en) | 1999-07-12 |
Family
ID=31911674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991027374U Expired - Fee Related JP2597784Y2 (en) | 1991-03-28 | 1991-03-28 | Heat dissipation structure of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2597784Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58109258U (en) * | 1982-01-18 | 1983-07-25 | クラリオン株式会社 | Heat sink for transistor mounting |
-
1991
- 1991-03-28 JP JP1991027374U patent/JP2597784Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04116149U (en) | 1992-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |