JPS6063980U - Chip carrier package structure - Google Patents

Chip carrier package structure

Info

Publication number
JPS6063980U
JPS6063980U JP15524283U JP15524283U JPS6063980U JP S6063980 U JPS6063980 U JP S6063980U JP 15524283 U JP15524283 U JP 15524283U JP 15524283 U JP15524283 U JP 15524283U JP S6063980 U JPS6063980 U JP S6063980U
Authority
JP
Japan
Prior art keywords
package structure
chip carrier
carrier package
heat dissipation
dissipation fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15524283U
Other languages
Japanese (ja)
Inventor
武富 剛
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP15524283U priority Critical patent/JPS6063980U/en
Publication of JPS6063980U publication Critical patent/JPS6063980U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、一般的なチップキャリアのパッケージ構造を
示す斜視図、第2図は、従来から用いられている放熱フ
ィンを付加したチップキャリアのパッケージ構造を示す
斜視図そして、第3図は、本考案に係るチップキャリア
のパッケージ構造の一実施例を示す斜視図である。 1・・・・・・チップキャリア、2・・・・・・ケーシ
ング用リッド、3・・・・・・放熱フィン、4・・・・
・・ケーシング用リッド、5・・・・・・放熱フィン。
FIG. 1 is a perspective view showing the package structure of a general chip carrier, FIG. 2 is a perspective view showing the package structure of a chip carrier with conventionally used radiation fins, and FIG. FIG. 1 is a perspective view showing an embodiment of a package structure of a chip carrier according to the present invention. 1... Chip carrier, 2... Casing lid, 3... Radiation fin, 4...
...Lid for casing, 5...Radiation fin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ケーシング用リッド上に放熱フィンを備えたチップキャ
リアのパッケージ構造において、上記ケーシング用リッ
ドと放熱フィンとを一体的に形成したことを特徴とする
チップキャリアのパッケージ構造。
A chip carrier package structure including a heat dissipation fin on a casing lid, characterized in that the casing lid and the heat dissipation fin are integrally formed.
JP15524283U 1983-10-06 1983-10-06 Chip carrier package structure Pending JPS6063980U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15524283U JPS6063980U (en) 1983-10-06 1983-10-06 Chip carrier package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15524283U JPS6063980U (en) 1983-10-06 1983-10-06 Chip carrier package structure

Publications (1)

Publication Number Publication Date
JPS6063980U true JPS6063980U (en) 1985-05-07

Family

ID=30342925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15524283U Pending JPS6063980U (en) 1983-10-06 1983-10-06 Chip carrier package structure

Country Status (1)

Country Link
JP (1) JPS6063980U (en)

Similar Documents

Publication Publication Date Title
JPS6063980U (en) Chip carrier package structure
JPS6018550U (en) Heat dissipation structure
JPS59107157U (en) GaAs semiconductor device
JPS59182939U (en) Semiconductor package cage with radiator
JPS58180643U (en) Semiconductor device package
JPS58116235U (en) Heat dissipation device for electronic components
JPS59145055U (en) Heat sink for semiconductor laser
JPS5952697U (en) packaging tape
JPS59166488U (en) Heat dissipation structure
JPS6066041U (en) IC package
JPS6068656U (en) Semiconductor device with heat sink
JPS5837153U (en) Semiconductor element with heat dissipation fins
JPS6113940U (en) semiconductor equipment
JPS587350U (en) Cooling structure for lead type semiconductor devices
JPS59111097U (en) semiconductor equipment
JPS60141142U (en) Heat dissipation fins for semiconductor devices
JPS58150843U (en) Container for hybrid integrated circuit
JPS60113642U (en) semiconductor equipment
JPS58135949U (en) Thermal conductive tape with heat dissipation fins
JPS59159952U (en) heat sink structure
JPS5874345U (en) heat sink fins
JPS6015490U (en) solder paste packaging
JPS58116236U (en) hybrid integrated circuit
JPS6013751U (en) Heat dissipation structure of heating element
JPS58182434U (en) semiconductor equipment