JPS58180643U - Semiconductor device package - Google Patents

Semiconductor device package

Info

Publication number
JPS58180643U
JPS58180643U JP7674882U JP7674882U JPS58180643U JP S58180643 U JPS58180643 U JP S58180643U JP 7674882 U JP7674882 U JP 7674882U JP 7674882 U JP7674882 U JP 7674882U JP S58180643 U JPS58180643 U JP S58180643U
Authority
JP
Japan
Prior art keywords
semiconductor device
device package
groove
recorded
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7674882U
Other languages
Japanese (ja)
Inventor
茂 川村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Faurecia Clarion Electronics Co Ltd
Original Assignee
Clarion Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clarion Co Ltd filed Critical Clarion Co Ltd
Priority to JP7674882U priority Critical patent/JPS58180643U/en
Publication of JPS58180643U publication Critical patent/JPS58180643U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例の斜面図、第２図は本考案パッケージの
斜面図、第３図はその組み合わせ状態を示し、第４図は
本考案の別実施例で、１・・・パッケージ本体、２・・
・溝。FIG. 1 is a perspective view of the conventional example, FIG. 2 is a perspective view of the package of the present invention, FIG. 3 is a combination thereof, and FIG. 4 is another embodiment of the present invention. 2...
·groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 周期的な溝を有するパッケージにおいて、溝巾と溝間隔
が同一に設定されて成る半導体装置のパッケージ。A semiconductor device package having periodic grooves in which the groove width and the groove interval are set to be the same.
JP7674882U 1982-05-25 1982-05-25 Semiconductor device package Pending JPS58180643U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7674882U JPS58180643U (en) 1982-05-25 1982-05-25 Semiconductor device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7674882U JPS58180643U (en) 1982-05-25 1982-05-25 Semiconductor device package

Publications (1)

Publication Number Publication Date
JPS58180643U true JPS58180643U (en) 1983-12-02

Family

ID=30086047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7674882U Pending JPS58180643U (en) 1982-05-25 1982-05-25 Semiconductor device package

Country Status (1)

Country Link
JP (1) JPS58180643U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60182752A (en) * 1984-02-29 1985-09-18 Hitachi Ltd Resin-coated electronic device
JP2006100327A (en) * 2004-09-28 2006-04-13 Mitsubishi Electric Corp Semiconductor device and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60182752A (en) * 1984-02-29 1985-09-18 Hitachi Ltd Resin-coated electronic device
JP2006100327A (en) * 2004-09-28 2006-04-13 Mitsubishi Electric Corp Semiconductor device and manufacturing method thereof

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