JPS58116236U - hybrid integrated circuit - Google Patents

hybrid integrated circuit

Info

Publication number
JPS58116236U
JPS58116236U JP1344282U JP1344282U JPS58116236U JP S58116236 U JPS58116236 U JP S58116236U JP 1344282 U JP1344282 U JP 1344282U JP 1344282 U JP1344282 U JP 1344282U JP S58116236 U JPS58116236 U JP S58116236U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
heat
metal case
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1344282U
Other languages
Japanese (ja)
Inventor
和志 岩田
Original Assignee
株式会社リコー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社リコー filed Critical 株式会社リコー
Priority to JP1344282U priority Critical patent/JPS58116236U/en
Publication of JPS58116236U publication Critical patent/JPS58116236U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の混成集積回路（ハイブリッドｉｃ）の縦
断面図、第４図はこの考案の一実施例に係−る混成集積
回路（ハイブリッドＩＣ）の縦断面図である。 １．２１・・・ヒートシンカー、２．２２・・・半導体
部品（半導体チップ）、３．４３・・・金属ケース。FIG. 1 is a vertical cross-sectional view of a conventional hybrid integrated circuit (hybrid IC), and FIG. 4 is a vertical cross-sectional view of a hybrid integrated circuit (hybrid IC) according to an embodiment of this invention. 1.21... Heat sinker, 2.22... Semiconductor component (semiconductor chip), 3.43... Metal case.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ”　放熱用ヒートシンカーに固着した半導体部品を金属
ケース函に配設した混成集積回路において、前記金属ケ
ースの内、外面に放射率が大きくなるよ□うな表面処理
を施すとともに、前記ヒートシンカーに放熱フィンを付
けたことを特徴とする混成集積回路。” In a hybrid integrated circuit in which a semiconductor component fixed to a heat sinker for heat dissipation is arranged in a metal case box, the inner and outer surfaces of the metal case are subjected to a surface treatment that increases the emissivity, and the heat sinker is provided with heat dissipation. A hybrid integrated circuit characterized by the addition of fins.
JP1344282U 1982-02-02 1982-02-02 hybrid integrated circuit Pending JPS58116236U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1344282U JPS58116236U (en) 1982-02-02 1982-02-02 hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1344282U JPS58116236U (en) 1982-02-02 1982-02-02 hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS58116236U true JPS58116236U (en) 1983-08-08

Family

ID=30025957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1344282U Pending JPS58116236U (en) 1982-02-02 1982-02-02 hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS58116236U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145657A (en) * 1997-11-05 1999-05-28 Matsushita Electric Ind Co Ltd Heat radiating apparatus for electronic parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145657A (en) * 1997-11-05 1999-05-28 Matsushita Electric Ind Co Ltd Heat radiating apparatus for electronic parts

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