JPS6113947U - Semiconductor heat dissipation equipment for audio products - Google Patents
Semiconductor heat dissipation equipment for audio productsInfo
- Publication number
- JPS6113947U JPS6113947U JP9819284U JP9819284U JPS6113947U JP S6113947 U JPS6113947 U JP S6113947U JP 9819284 U JP9819284 U JP 9819284U JP 9819284 U JP9819284 U JP 9819284U JP S6113947 U JPS6113947 U JP S6113947U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- semiconductor
- heat sink
- semiconductor heat
- dissipation equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の一実施例である放熱装置の側面図、第
2図は放熱装置の上面図、第3図は他の実施例を示す側
面図、第4図は従来の放熱装置の側面図である。
2・・・パワートランジスタ(¥21)、4・・・tJ
ヒートシンク、5・・・チムニ形ヒートシンク、8・・
・ヒートシンク。Fig. 1 is a side view of a heat dissipation device which is an embodiment of the present invention, Fig. 2 is a top view of the heat dissipation device, Fig. 3 is a side view showing another embodiment, and Fig. 4 is a side view of a conventional heat dissipation device. FIG. 2...Power transistor (¥21), 4...tJ
Heat sink, 5... Chimney type heat sink, 8...
·heat sink.
Claims (1)
半導体の発生する熱を放出する放熱装置であって、 前記半導体に取付けられる断面L字状のL形ヒートシン
クと、 このL形ヒートシンクに取付けられ、放熱のための空間
を有し、かつ開放端のないヒートシンクと、からなる音
響製品の半導体放熱装置。 2 前記L形ヒートシンクとヒートシンクとの間にシリ
コングリスを介在させたことを特徴とする音響製品の半
導体放熱装置。[Claims for Utility Model Registration] 1. A device that is attached to a semiconductor provided inside an audio product,
A heat dissipation device for dissipating heat generated by a semiconductor, comprising an L-shaped heat sink with an L-shaped cross section attached to the semiconductor, and an open-ended heat sink attached to the L-shaped heat sink, having a space for heat dissipation, and A semiconductor heat dissipation device for acoustic products consisting of no heat sink. 2. A semiconductor heat dissipation device for an acoustic product, characterized in that silicone grease is interposed between the L-shaped heat sink and the heat sink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9819284U JPS6113947U (en) | 1984-06-29 | 1984-06-29 | Semiconductor heat dissipation equipment for audio products |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9819284U JPS6113947U (en) | 1984-06-29 | 1984-06-29 | Semiconductor heat dissipation equipment for audio products |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6113947U true JPS6113947U (en) | 1986-01-27 |
Family
ID=30657740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9819284U Pending JPS6113947U (en) | 1984-06-29 | 1984-06-29 | Semiconductor heat dissipation equipment for audio products |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6113947U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62102142U (en) * | 1985-12-18 | 1987-06-29 |
-
1984
- 1984-06-29 JP JP9819284U patent/JPS6113947U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62102142U (en) * | 1985-12-18 | 1987-06-29 |
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