JPS6013762U - semiconductor laser - Google Patents

semiconductor laser

Info

Publication number
JPS6013762U
JPS6013762U JP10585383U JP10585383U JPS6013762U JP S6013762 U JPS6013762 U JP S6013762U JP 10585383 U JP10585383 U JP 10585383U JP 10585383 U JP10585383 U JP 10585383U JP S6013762 U JPS6013762 U JP S6013762U
Authority
JP
Japan
Prior art keywords
semiconductor laser
heat sink
fixed
laser chip
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10585383U
Other languages
Japanese (ja)
Inventor
野島 正信
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP10585383U priority Critical patent/JPS6013762U/en
Publication of JPS6013762U publication Critical patent/JPS6013762U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図A、 Bは従来例を示す断面図及び斜視図、第2
図A、 Bは本考案の一実施例を示す断面図及び斜視図
である。 1・・・・・・半導体レーザチップ、2・・・・・・第
1ヒートシンク、3・・・・・・第2ヒートシンク、4
・・・・・・へき開面。
Figures 1A and B are cross-sectional and perspective views showing the conventional example;
Figures A and B are a sectional view and a perspective view showing an embodiment of the present invention. 1... Semiconductor laser chip, 2... First heat sink, 3... Second heat sink, 4
......cleavage plane.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体レーザチップ、該チップが固着された第1ヒート
シンク、該第1ヒートシンクが固着された第2ヒートシ
ンクを備え、上記第1、第2ヒートシンクの上記半導体
レーザチップのへき開面に平行でかつ上記両ヒートシン
クの固着面に平行な辺の長さが同一であることを特徴と
する半導体し
a semiconductor laser chip, a first heat sink to which the chip is fixed, and a second heat sink to which the first heat sink is fixed, the first and second heat sinks being parallel to a cleavage plane of the semiconductor laser chip and both heat sinks; A semiconductor characterized in that the lengths of the sides parallel to the fixed surface are the same.
JP10585383U 1983-07-06 1983-07-06 semiconductor laser Pending JPS6013762U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10585383U JPS6013762U (en) 1983-07-06 1983-07-06 semiconductor laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10585383U JPS6013762U (en) 1983-07-06 1983-07-06 semiconductor laser

Publications (1)

Publication Number Publication Date
JPS6013762U true JPS6013762U (en) 1985-01-30

Family

ID=30247949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10585383U Pending JPS6013762U (en) 1983-07-06 1983-07-06 semiconductor laser

Country Status (1)

Country Link
JP (1) JPS6013762U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327213U (en) * 1986-07-31 1988-02-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327213U (en) * 1986-07-31 1988-02-23

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