JPS58116234U - Thick film module heat sink - Google Patents
Thick film module heat sinkInfo
- Publication number
- JPS58116234U JPS58116234U JP1149882U JP1149882U JPS58116234U JP S58116234 U JPS58116234 U JP S58116234U JP 1149882 U JP1149882 U JP 1149882U JP 1149882 U JP1149882 U JP 1149882U JP S58116234 U JPS58116234 U JP S58116234U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- thick film
- film module
- module heat
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の厚膜モジュール放熱板構造図、第２図、
第３図は本考案の一実施例を示し、第２図は斜視図、第
３図はその側面図である。
１・・・厚膜モジュール、２・・・放熱板、３・・・改
良放熱板。 、 。Figure 1 is a structural diagram of a conventional thick film module heat sink; Figure 2 is a structural diagram of a conventional thick film module heat sink;
FIG. 3 shows an embodiment of the present invention, FIG. 2 is a perspective view, and FIG. 3 is a side view thereof. 1... Thick film module, 2... Heat sink, 3... Improved heat sink. , .
Claims (1)
、放熱板中央にモジュールを接着した時と同じ効果を持
つように放熱板下部を、モジュール接着面反対側へ折り
曲げたことを特徴とする厚膜モジュール放熱板。゛A thick film module characterized by bending the lower part of the heat sink to the side opposite to the module bonding surface so that when the thick film module ceramic substrate is bonded to the heat sink, it has the same effect as when the module is bonded to the center of the heat sink. Module heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1149882U JPS58116234U (en) | 1982-02-01 | 1982-02-01 | Thick film module heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1149882U JPS58116234U (en) | 1982-02-01 | 1982-02-01 | Thick film module heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58116234U true JPS58116234U (en) | 1983-08-08 |
Family
ID=30024105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1149882U Pending JPS58116234U (en) | 1982-02-01 | 1982-02-01 | Thick film module heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58116234U (en) |
-
1982
- 1982-02-01 JP JP1149882U patent/JPS58116234U/en active Pending
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