JPS5820539U - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS5820539U JPS5820539U JP1981113354U JP11335481U JPS5820539U JP S5820539 U JPS5820539 U JP S5820539U JP 1981113354 U JP1981113354 U JP 1981113354U JP 11335481 U JP11335481 U JP 11335481U JP S5820539 U JPS5820539 U JP S5820539U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit device
- electrodes
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図、第２図は従来の封止構造の断面図。第３図は本
発明の封止構造の断面図、第４図は本発明の封止構造の
斜視図である。
１・・・半導体集積回路、３・・・インナーリード、１
０．１２・・・封止枠、１１・・・熱カシメ、１３・・
・位置合わせ用突起、８，１８・・・封止樹脂である。FIGS. 1 and 2 are cross-sectional views of conventional sealing structures. FIG. 3 is a sectional view of the sealing structure of the present invention, and FIG. 4 is a perspective view of the sealing structure of the present invention. 1... Semiconductor integrated circuit, 3... Inner lead, 1
0.12... Sealing frame, 11... Heat caulking, 13...
- Positioning protrusions, 8, 18... sealing resin.
Claims (2)
ードと半導体集積回路上の複数電極とを接合してなる半
導体集積回路の封止に於いて、該半導体集積回路の外形
部に嵌めこまれた封止枠を有する事を特徴とする半導体
集積回路装置。(1) In sealing a semiconductor integrated circuit in which a plurality of leads on a substrate protrude into holes in the substrate and the leads and a plurality of electrodes on a semiconductor integrated circuit are bonded, the outer shape of the semiconductor integrated circuit is A semiconductor integrated circuit device characterized by having a sealing frame fitted therein.
が、該半導体集積回路の電極を有する面側の１つ以上の
角または側端面であることを特徴とする実用新案登録請
求の範囲第１項記載の半、 導体集積回路。(2) Scope of a utility model registration claim characterized in that the outer shape of the semiconductor integrated circuit on which the sealing frame is positioned is one or more corners or side end surfaces of the surface of the semiconductor integrated circuit having electrodes. The semi-conductor integrated circuit according to paragraph 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981113354U JPS5820539U (en) | 1981-07-30 | 1981-07-30 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981113354U JPS5820539U (en) | 1981-07-30 | 1981-07-30 | Semiconductor integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5820539U true JPS5820539U (en) | 1983-02-08 |
Family
ID=29907658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981113354U Pending JPS5820539U (en) | 1981-07-30 | 1981-07-30 | Semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5820539U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0490342A (en) * | 1990-08-06 | 1992-03-24 | Teijin Ltd | Lid material |
-
1981
- 1981-07-30 JP JP1981113354U patent/JPS5820539U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0490342A (en) * | 1990-08-06 | 1992-03-24 | Teijin Ltd | Lid material |
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