JPS5942095U - Heat sink mounting structure - Google Patents

Heat sink mounting structure

Info

Publication number
JPS5942095U
JPS5942095U JP13785282U JP13785282U JPS5942095U JP S5942095 U JPS5942095 U JP S5942095U JP 13785282 U JP13785282 U JP 13785282U JP 13785282 U JP13785282 U JP 13785282U JP S5942095 U JPS5942095 U JP S5942095U
Authority
JP
Japan
Prior art keywords
heat sink
mounting structure
sink mounting
thick film
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13785282U
Other languages
Japanese (ja)
Inventor
佐藤　喜久男
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP13785282U priority Critical patent/JPS5942095U/en
Publication of JPS5942095U publication Critical patent/JPS5942095U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は厚膜ＩＣ基板に対する放熱板の取り付は状態を
示す断面図である。第２図は従来の放熱板の取り付は構
造を示す斜視図であり、第３図はその要部の裏面図、第
４図は側面図である。第５図は本考案の放熱板取り付は
構造の要部裏面図であり、第６図はその側面図である。 １・・・厚膜ｉｃ基板、１ｂ・・・裏面、２・・・放熱
板、３・・・接着樹脂、４・・・端子、５・・・孔。FIG. 1 is a sectional view showing how a heat sink is attached to a thick film IC substrate. FIG. 2 is a perspective view showing the structure of a conventional heat sink, FIG. 3 is a back view of the main parts thereof, and FIG. 4 is a side view. FIG. 5 is a back view of the main part of the heat sink mounting structure of the present invention, and FIG. 6 is a side view thereof. DESCRIPTION OF SYMBOLS 1... Thick film IC board, 1b... Back surface, 2... Heat sink, 3... Adhesive resin, 4... Terminal, 5... Hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 厚膜ＩＣ基板の裏面に接合される放熱板の接合部分の周
辺に前記厚膜ｉｃ基板と放熱板との間に施された接着樹
脂がはみ出すための孔を設けたことを特徴とする放熱板
取り付は構造。A heat sink, characterized in that a hole is provided around a joint portion of the heat sink to be bonded to the back surface of a thick film IC board, through which the adhesive resin applied between the thick film IC board and the heat sink protrudes. The installation is structural.
JP13785282U 1982-09-10 1982-09-10 Heat sink mounting structure Pending JPS5942095U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13785282U JPS5942095U (en) 1982-09-10 1982-09-10 Heat sink mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13785282U JPS5942095U (en) 1982-09-10 1982-09-10 Heat sink mounting structure

Publications (1)

Publication Number Publication Date
JPS5942095U true JPS5942095U (en) 1984-03-17

Family

ID=30309499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13785282U Pending JPS5942095U (en) 1982-09-10 1982-09-10 Heat sink mounting structure

Country Status (1)

Country Link
JP (1) JPS5942095U (en)

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