JPS6035566U - flexible printed circuit board - Google Patents
flexible printed circuit boardInfo
- Publication number
- JPS6035566U JPS6035566U JP12718883U JP12718883U JPS6035566U JP S6035566 U JPS6035566 U JP S6035566U JP 12718883 U JP12718883 U JP 12718883U JP 12718883 U JP12718883 U JP 12718883U JP S6035566 U JPS6035566 U JP S6035566U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- flexible printed
- back side
- backing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図ないし第3図はフレキシブル基板の従来例を示す
もので、第1図は裏面側の斜視図、第2図は断面図、第
3図は保護板を使用した状態を示す断面図、第4図は本
考案の一実施例を示す断面図、第5図は試験片の断面図
である。
1・・・軟質基板、3・・・熱硬化性接着剤、5・・・
金属箔、11・・・裏打ち板、12・・・傾斜面。1 to 3 show conventional examples of flexible substrates, in which FIG. 1 is a perspective view of the back side, FIG. 2 is a sectional view, and FIG. 3 is a sectional view showing a state in which a protection plate is used. FIG. 4 is a sectional view showing an embodiment of the present invention, and FIG. 5 is a sectional view of a test piece. 1... Soft substrate, 3... Thermosetting adhesive, 5...
Metal foil, 11... Backing plate, 12... Slanted surface.
Claims (1)
接着したフレキシブルプリント基板において、前記裏打
ち板の裏面側の周縁部に、漸次板厚を減少させる傾斜面
12を設けたことを特徴とするフレキシブルプリント基
板。A flexible printed circuit board having a reinforcing backing plate 11 bonded to the back side with a thermosetting adhesive 3, characterized in that an inclined surface 12 is provided on the peripheral edge of the back side of the backing plate to gradually reduce the board thickness. flexible printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12718883U JPS6035566U (en) | 1983-08-17 | 1983-08-17 | flexible printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12718883U JPS6035566U (en) | 1983-08-17 | 1983-08-17 | flexible printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6035566U true JPS6035566U (en) | 1985-03-11 |
Family
ID=30288961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12718883U Pending JPS6035566U (en) | 1983-08-17 | 1983-08-17 | flexible printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6035566U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010199383A (en) * | 2009-02-26 | 2010-09-09 | Fujikura Ltd | Substrate with adhesive, and flexible printed circuit wiring board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5650835B2 (en) * | 1979-01-30 | 1981-12-01 | ||
JPS5745073A (en) * | 1980-08-30 | 1982-03-13 | Tdk Corp | Heat-sensitive recording head |
-
1983
- 1983-08-17 JP JP12718883U patent/JPS6035566U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5650835B2 (en) * | 1979-01-30 | 1981-12-01 | ||
JPS5745073A (en) * | 1980-08-30 | 1982-03-13 | Tdk Corp | Heat-sensitive recording head |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010199383A (en) * | 2009-02-26 | 2010-09-09 | Fujikura Ltd | Substrate with adhesive, and flexible printed circuit wiring board |
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