JPS5918458U - Flexible substrate with backing substrate - Google Patents
Flexible substrate with backing substrateInfo
- Publication number
- JPS5918458U JPS5918458U JP11239282U JP11239282U JPS5918458U JP S5918458 U JPS5918458 U JP S5918458U JP 11239282 U JP11239282 U JP 11239282U JP 11239282 U JP11239282 U JP 11239282U JP S5918458 U JPS5918458 U JP S5918458U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- backing
- flexible
- flexible substrate
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は裏打ち基板を有するフレキシブル基板の斜視図
、第２図はその側面図、第３図は本考案による裏打ち基
板を有するフレキシブル基板の斜視図、第４図はその側
面図、第５図および第６図は本考案による裏打ち基板を
有するフレキシブル基板の使用方法を説明するための側
面図、第７図は本考案の他の実施の態様による裏打ち基
板を有するフレキシブル基板の斜視図である。
１・・・・・・フレキシブル基板、２・・・・・・裏打
ち基板、３・・・・・・基板に取り付けられた部品、４
・・・・・・取り付けられた部品のハンダ付け、５・・
・・・・接着材、６・・・・・・ミシン目、７・・・・
・・接着されていない部分、８・・・・・・ビスＬ ９
−−−−−−ビス。FIG. 1 is a perspective view of a flexible substrate with a backing substrate, FIG. 2 is a side view thereof, FIG. 3 is a perspective view of a flexible substrate with a backing substrate according to the present invention, FIG. 4 is a side view thereof, and FIG. 5 6 is a side view illustrating a method of using a flexible substrate having a backing substrate according to the present invention, and FIG. 7 is a perspective view of a flexible substrate having a backing substrate according to another embodiment of the present invention. 1... Flexible board, 2... Backing board, 3... Parts attached to the board, 4
・・・・・・Soldering of installed parts, 5...
・・・Adhesive material, 6...Perforation, 7...
・・Part not glued, 8・・・・Screw L 9
−−−−−−Bis.
Claims (1)
数の区画に分割されており、裏打ち基板となるべき部分
はフレキシブル基板に接着材を使って接着されており、
他の部分は接着されておらず、ミシン目に沿って割った
後では上記フレキシブル基板から剥がすことができるよ
うになっていることを特徴とする裏打ち基板を有するフ
レキシブル基板。It has a holding substrate, the holding substrate is divided into a plurality of sections by perforations, and a portion to be a backing substrate is bonded to a flexible substrate using an adhesive,
A flexible substrate having a backing substrate, characterized in that other parts are not bonded and can be peeled off from the flexible substrate after being split along perforations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11239282U JPS5918458U (en) | 1982-07-23 | 1982-07-23 | Flexible substrate with backing substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11239282U JPS5918458U (en) | 1982-07-23 | 1982-07-23 | Flexible substrate with backing substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5918458U true JPS5918458U (en) | 1984-02-04 |
Family
ID=30260563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11239282U Pending JPS5918458U (en) | 1982-07-23 | 1982-07-23 | Flexible substrate with backing substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5918458U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54157275A (en) * | 1978-06-02 | 1979-12-12 | Tokyo Shibaura Electric Co | Method of producing flexible compound printed circuit board |
-
1982
- 1982-07-23 JP JP11239282U patent/JPS5918458U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54157275A (en) * | 1978-06-02 | 1979-12-12 | Tokyo Shibaura Electric Co | Method of producing flexible compound printed circuit board |
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