JPS58180699U - Electronic component taping structure - Google Patents

Electronic component taping structure

Info

Publication number
JPS58180699U
JPS58180699U JP7744582U JP7744582U JPS58180699U JP S58180699 U JPS58180699 U JP S58180699U JP 7744582 U JP7744582 U JP 7744582U JP 7744582 U JP7744582 U JP 7744582U JP S58180699 U JPS58180699 U JP S58180699U
Authority
JP
Japan
Prior art keywords
electronic component
adhesive
coated
component taping
taping structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7744582U
Other languages
Japanese (ja)
Inventor
誠 伊藤
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP7744582U priority Critical patent/JPS58180699U/en
Publication of JPS58180699U publication Critical patent/JPS58180699U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の平面図である。 １・・・・・・台紙、２・・・・・・粘着剤塗布領域、
３・・・・・・電子部品、４・・・・・・テープ。FIG. 1 is a plan view of an embodiment of the present invention. 1... Mounting paper, 2... Adhesive application area,
3...Electronic parts, 4...Tape.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一面に粘着剤が塗布されたテープ吠の台紙と、該台紙の
粘着剤塗布面に一定間隔で配置され粘着された電子部品
と、−面に粘着剤が塗布された該粘着剤塗布面を前記電
子部品の上並びに前記台紙の粘着剤塗布面に貼合せたテ
ープとを含むことを特徴とする電子部品テーピング構造
。A tape mount coated with adhesive on one side, electronic components arranged at regular intervals and adhered to the adhesive coated side of the mount, and the adhesive coated side with adhesive coated on the - side. 1. An electronic component taping structure comprising: a tape pasted on an electronic component and on an adhesive-coated surface of the mount.
JP7744582U 1982-05-26 1982-05-26 Electronic component taping structure Pending JPS58180699U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7744582U JPS58180699U (en) 1982-05-26 1982-05-26 Electronic component taping structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7744582U JPS58180699U (en) 1982-05-26 1982-05-26 Electronic component taping structure

Publications (1)

Publication Number Publication Date
JPS58180699U true JPS58180699U (en) 1983-12-02

Family

ID=30086703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7744582U Pending JPS58180699U (en) 1982-05-26 1982-05-26 Electronic component taping structure

Country Status (1)

Country Link
JP (1) JPS58180699U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60172397U (en) * 1984-04-20 1985-11-15 株式会社村田製作所 taping electronic parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60172397U (en) * 1984-04-20 1985-11-15 株式会社村田製作所 taping electronic parts

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