JPS58116269U - flexible circuit board - Google Patents

flexible circuit board

Info

Publication number
JPS58116269U
JPS58116269U JP1226682U JP1226682U JPS58116269U JP S58116269 U JPS58116269 U JP S58116269U JP 1226682 U JP1226682 U JP 1226682U JP 1226682 U JP1226682 U JP 1226682U JP S58116269 U JPS58116269 U JP S58116269U
Authority
JP
Japan
Prior art keywords
circuit board
flexible circuit
cover film
connection portion
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1226682U
Other languages
Japanese (ja)
Inventor
高坂 新次郎
博文 松本
Original Assignee
日本メクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Priority to JP1226682U priority Critical patent/JPS58116269U/en
Publication of JPS58116269U publication Critical patent/JPS58116269U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

−第1図は従来構造によるカバーフィルム付可撓性回路
基板の概念的な部分平面構成図、第2図および第3図は
未考案の好ましい実施例によるカバーフィルム付可撓性
回路基板の概念的な要部断面2構成図である。 1・・・・・・ベースフィルム、2・・・・・・回路パ
ターン、2A・・・・・・接続部分、3.・・・・・・
カバーフィルム、5゜6・・・・・・漸減部。
- Fig. 1 is a conceptual partial plan configuration diagram of a flexible circuit board with a cover film according to a conventional structure, and Figs. 2 and 3 are conceptual diagrams of a flexible circuit board with a cover film according to a yet-to-be-devised preferred embodiment. FIG. 2 is a sectional view of two main parts. 1...Base film, 2...Circuit pattern, 2A...Connection part, 3.・・・・・・
Cover film, 5°6... Gradual decreasing part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路パターン上にカバーフィルムを設けるようにした可
撓性回路基板においt1回路パターンの露出接続部分と
接する上記カバーフィルム繊縁の厚さを下記接続部分方
向に漸減すべく構成してなる可撓性回路基板。    
−′
A flexible circuit board in which a cover film is provided on the circuit pattern, and the thickness of the cover film fiber edge in contact with the exposed connection portion of the t1 circuit pattern is gradually reduced in the direction of the connection portion as described below. circuit board.
−′
JP1226682U 1982-01-30 1982-01-30 flexible circuit board Pending JPS58116269U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1226682U JPS58116269U (en) 1982-01-30 1982-01-30 flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1226682U JPS58116269U (en) 1982-01-30 1982-01-30 flexible circuit board

Publications (1)

Publication Number Publication Date
JPS58116269U true JPS58116269U (en) 1983-08-08

Family

ID=30024851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1226682U Pending JPS58116269U (en) 1982-01-30 1982-01-30 flexible circuit board

Country Status (1)

Country Link
JP (1) JPS58116269U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6336074U (en) * 1986-08-23 1988-03-08
JPS6336075U (en) * 1986-08-25 1988-03-08
JP2005183740A (en) * 2003-12-19 2005-07-07 Mitsui Mining & Smelting Co Ltd Printed wiring board and semiconductor device
JP2006126367A (en) * 2004-10-27 2006-05-18 Mitsui Mining & Smelting Co Ltd Display apparatus and method for manufacturing same
JP2010199540A (en) * 2009-02-02 2010-09-09 Fujitsu Ltd Circuit board, method of manufacturing same, and resistance element
JP2010278294A (en) * 2009-05-29 2010-12-09 Fujikura Ltd Flexible printed circuit board and method of manufacturing the same
WO2022102164A1 (en) * 2020-11-12 2022-05-19 株式会社フジクラ Wiring board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6336074U (en) * 1986-08-23 1988-03-08
JPS6336075U (en) * 1986-08-25 1988-03-08
JP2005183740A (en) * 2003-12-19 2005-07-07 Mitsui Mining & Smelting Co Ltd Printed wiring board and semiconductor device
JP2006126367A (en) * 2004-10-27 2006-05-18 Mitsui Mining & Smelting Co Ltd Display apparatus and method for manufacturing same
JP4641783B2 (en) * 2004-10-27 2011-03-02 三井金属鉱業株式会社 Display device
JP2010199540A (en) * 2009-02-02 2010-09-09 Fujitsu Ltd Circuit board, method of manufacturing same, and resistance element
JP2010278294A (en) * 2009-05-29 2010-12-09 Fujikura Ltd Flexible printed circuit board and method of manufacturing the same
WO2022102164A1 (en) * 2020-11-12 2022-05-19 株式会社フジクラ Wiring board

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