JPS6336075U - - Google Patents
Info
- Publication number
- JPS6336075U JPS6336075U JP12815986U JP12815986U JPS6336075U JP S6336075 U JPS6336075 U JP S6336075U JP 12815986 U JP12815986 U JP 12815986U JP 12815986 U JP12815986 U JP 12815986U JP S6336075 U JPS6336075 U JP S6336075U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- resist film
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の第１実施例に係るフレキシブ
ル印刷配線板の要部の平面図、第２図は本考案の
第２実施例に係るフレキシブル印刷配線板の要部
の平面図、第３図は第２図のＢ―Ｂ線に沿う断面
図、第４図は従来のフレキシブル印刷配線板の平
面図、第５図は第４図のＡ―Ａ線に沿う断面図で
ある。
１……絶縁フイルム、２……導電パターン、２
ａ……リード部、３……レジスト層、３′……波
状部、３ａ……第１のレジスト膜、３ｂ……第２
のレジスト膜、３ｃ……第３のレジスト膜。
FIG. 1 is a plan view of main parts of a flexible printed wiring board according to a first embodiment of the present invention, FIG. 2 is a plan view of main parts of a flexible printed wiring board according to a second embodiment of the present invention, and FIG. The figures are a sectional view taken along line BB in FIG. 2, FIG. 4 is a plan view of a conventional flexible printed wiring board, and FIG. 5 is a sectional view taken along line AA in FIG. 4. 1... Insulating film, 2... Conductive pattern, 2
a... Lead portion, 3... Resist layer, 3'... Wavy portion, 3a... First resist film, 3b... Second
resist film, 3c... third resist film.
Claims (1)
が設けられ、該導電パターンを覆つて複数層のレ
ジスト膜が設けられているフレキシブル印刷配線
板において、前記レジスト膜の端面を波状に形成
したことを特徴とするフレキシブル印刷配線板。 A flexible printed wiring board in which a conductive pattern is provided on a flexible insulating film, and a plurality of layers of resist film are provided covering the conductive pattern, characterized in that the end face of the resist film is formed in a wavy shape. Flexible printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986128159U JPH0432783Y2 (en) | 1986-08-25 | 1986-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986128159U JPH0432783Y2 (en) | 1986-08-25 | 1986-08-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6336075U true JPS6336075U (en) | 1988-03-08 |
| JPH0432783Y2 JPH0432783Y2 (en) | 1992-08-06 |
Family
ID=31023578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986128159U Expired JPH0432783Y2 (en) | 1986-08-25 | 1986-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432783Y2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09289369A (en) * | 1996-02-19 | 1997-11-04 | Asahi Optical Co Ltd | Fpc board |
| JP2005183740A (en) * | 2003-12-19 | 2005-07-07 | Mitsui Mining & Smelting Co Ltd | Printed wiring board and semiconductor device |
| JP2013254550A (en) * | 2012-06-08 | 2013-12-19 | Dainippon Printing Co Ltd | Flexure substrate for suspension |
| JP2013254549A (en) * | 2012-06-08 | 2013-12-19 | Dainippon Printing Co Ltd | Flexure substrate for suspension |
| WO2019035248A1 (en) * | 2017-08-14 | 2019-02-21 | 住友電気工業株式会社 | Flexible printed wiring board |
| JP7006863B1 (en) * | 2021-06-09 | 2022-01-24 | 三菱電機株式会社 | Flexible printed board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5423259U (en) * | 1977-07-19 | 1979-02-15 | ||
| JPS5519015U (en) * | 1978-07-24 | 1980-02-06 | ||
| JPS58116268U (en) * | 1982-01-30 | 1983-08-08 | 日本メクトロン株式会社 | flexible circuit board |
| JPS58116269U (en) * | 1982-01-30 | 1983-08-08 | 日本メクトロン株式会社 | flexible circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5423259B2 (en) * | 1973-10-22 | 1979-08-13 |
-
1986
- 1986-08-25 JP JP1986128159U patent/JPH0432783Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5423259U (en) * | 1977-07-19 | 1979-02-15 | ||
| JPS5519015U (en) * | 1978-07-24 | 1980-02-06 | ||
| JPS58116268U (en) * | 1982-01-30 | 1983-08-08 | 日本メクトロン株式会社 | flexible circuit board |
| JPS58116269U (en) * | 1982-01-30 | 1983-08-08 | 日本メクトロン株式会社 | flexible circuit board |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09289369A (en) * | 1996-02-19 | 1997-11-04 | Asahi Optical Co Ltd | Fpc board |
| JP2005183740A (en) * | 2003-12-19 | 2005-07-07 | Mitsui Mining & Smelting Co Ltd | Printed wiring board and semiconductor device |
| JP2013254550A (en) * | 2012-06-08 | 2013-12-19 | Dainippon Printing Co Ltd | Flexure substrate for suspension |
| JP2013254549A (en) * | 2012-06-08 | 2013-12-19 | Dainippon Printing Co Ltd | Flexure substrate for suspension |
| WO2019035248A1 (en) * | 2017-08-14 | 2019-02-21 | 住友電気工業株式会社 | Flexible printed wiring board |
| JP2019036617A (en) * | 2017-08-14 | 2019-03-07 | 住友電気工業株式会社 | Flexible printed wiring board |
| CN110999545A (en) * | 2017-08-14 | 2020-04-10 | 住友电气工业株式会社 | Flexible printed circuit board |
| US10709016B2 (en) | 2017-08-14 | 2020-07-07 | Sumitomo Electric Industries, Ltd. | Flexible printed circuit board |
| CN110999545B (en) * | 2017-08-14 | 2023-06-20 | 住友电气工业株式会社 | Flexible printed circuit board |
| JP7006863B1 (en) * | 2021-06-09 | 2022-01-24 | 三菱電機株式会社 | Flexible printed board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0432783Y2 (en) | 1992-08-06 |