JPS6393672U - - Google Patents
Info
- Publication number
- JPS6393672U JPS6393672U JP18922386U JP18922386U JPS6393672U JP S6393672 U JPS6393672 U JP S6393672U JP 18922386 U JP18922386 U JP 18922386U JP 18922386 U JP18922386 U JP 18922386U JP S6393672 U JPS6393672 U JP S6393672U
- Authority
- JP
- Japan
- Prior art keywords
- signal wiring
- ground layer
- layers
- wiring layers
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
第１図は本考案の一実施例を示す多層配線基板
の断面図、第２図は従来の多層配線基板の一例を
示す断面図である。
５…絶縁層、６ａ，６ｂ，６ｃ…グランド層、
７ａ，７ｂ…信号配線層。
FIG. 1 is a cross-sectional view of a multilayer wiring board showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing an example of a conventional multilayer wiring board. 5... Insulating layer, 6a, 6b, 6c... Ground layer,
7a, 7b...Signal wiring layer.
Claims (1)
とを間に絶縁層を介して積層した多層配線基板に
おいて、前記各信号配線層を挟む配置でグランド
層を設けてなることを特徴とする多層配線基板。 A multilayer wiring board in which a plurality of signal wiring layers as conductor layers and a ground layer are laminated with an insulating layer interposed therebetween, characterized in that a ground layer is provided in an arrangement sandwiching each of the signal wiring layers. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18922386U JPS6393672U (en) | 1986-12-10 | 1986-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18922386U JPS6393672U (en) | 1986-12-10 | 1986-12-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6393672U true JPS6393672U (en) | 1988-06-17 |
Family
ID=31141320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18922386U Pending JPS6393672U (en) | 1986-12-10 | 1986-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6393672U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02237008A (en) * | 1989-03-09 | 1990-09-19 | Murata Mfg Co Ltd | Electronic component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55123195A (en) * | 1979-03-15 | 1980-09-22 | Fujitsu Ltd | Hollow coaxial structure multilayer printed board |
| JPS5854661A (en) * | 1981-09-29 | 1983-03-31 | Fujitsu Ltd | Multilayer ceramic semiconductor package |
| JPS58173890A (en) * | 1982-04-05 | 1983-10-12 | 株式会社日立製作所 | Multilayer circuit board |
-
1986
- 1986-12-10 JP JP18922386U patent/JPS6393672U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55123195A (en) * | 1979-03-15 | 1980-09-22 | Fujitsu Ltd | Hollow coaxial structure multilayer printed board |
| JPS5854661A (en) * | 1981-09-29 | 1983-03-31 | Fujitsu Ltd | Multilayer ceramic semiconductor package |
| JPS58173890A (en) * | 1982-04-05 | 1983-10-12 | 株式会社日立製作所 | Multilayer circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02237008A (en) * | 1989-03-09 | 1990-09-19 | Murata Mfg Co Ltd | Electronic component |