JPH0189781U - - Google Patents

Info

Publication number
JPH0189781U
JPH0189781U JP18555887U JP18555887U JPH0189781U JP H0189781 U JPH0189781 U JP H0189781U JP 18555887 U JP18555887 U JP 18555887U JP 18555887 U JP18555887 U JP 18555887U JP H0189781 U JPH0189781 U JP H0189781U
Authority
JP
Japan
Prior art keywords
circuit board
multilayer printed
printed circuit
electrodes
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18555887U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18555887U priority Critical patent/JPH0189781U/ja
Publication of JPH0189781U publication Critical patent/JPH0189781U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す断面図、第2
図および第3図は従来例を示す断面図である。 第1図〜第3図において、2,21……第2層
、3,22……第3層、5,7……電極、6……
誘電体、8,9,20,24……スルーホール、
10……絶縁体、11,12……配線パターン、
14……コンデンサ電極、15,23……コンデ
ンサ、16……ハンダ。
Fig. 1 is a sectional view showing one embodiment of the present invention;
FIG. 3 and FIG. 3 are cross-sectional views showing a conventional example. 1 to 3, 2, 21... second layer, 3, 22... third layer, 5, 7... electrode, 6...
Dielectric, 8, 9, 20, 24...through hole,
10... Insulator, 11, 12... Wiring pattern,
14... Capacitor electrode, 15, 23... Capacitor, 16... Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電気回路に用いられる多層プリント基板におい
て、この多層プリント基板の内層間に誘電体を電
極ではさんだノイズ防止用コンデンサを設けたこ
とを特徴とする多層プリント基板。
A multilayer printed circuit board used in an electric circuit, characterized in that a noise prevention capacitor having a dielectric sandwiched between electrodes is provided between inner layers of the multilayer printed circuit board.
JP18555887U 1987-12-04 1987-12-04 Pending JPH0189781U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18555887U JPH0189781U (en) 1987-12-04 1987-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18555887U JPH0189781U (en) 1987-12-04 1987-12-04

Publications (1)

Publication Number Publication Date
JPH0189781U true JPH0189781U (en) 1989-06-13

Family

ID=31476859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18555887U Pending JPH0189781U (en) 1987-12-04 1987-12-04

Country Status (1)

Country Link
JP (1) JPH0189781U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008178057A (en) * 2007-01-22 2008-07-31 Samsung Electronics Co Ltd Radio receiving device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008178057A (en) * 2007-01-22 2008-07-31 Samsung Electronics Co Ltd Radio receiving device
JP4603017B2 (en) * 2007-01-22 2010-12-22 三星電子株式会社 Wireless receiver

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