JPH0472680U - - Google Patents
Info
- Publication number
- JPH0472680U JPH0472680U JP11698990U JP11698990U JPH0472680U JP H0472680 U JPH0472680 U JP H0472680U JP 11698990 U JP11698990 U JP 11698990U JP 11698990 U JP11698990 U JP 11698990U JP H0472680 U JPH0472680 U JP H0472680U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring board
- printed wiring
- conductive hole
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図は本考案の一実施例のＰ板の構成を示す
断面図、第２図は従来のＰ板の構成を示す断面図
である。
１……従来のＰ板部、２……絶縁層及び最外層
部、３……最外層と内側層のみの導通部。
FIG. 1 is a sectional view showing the structure of a P plate according to an embodiment of the present invention, and FIG. 2 is a sectional view showing the structure of a conventional P plate. 1...Conventional P plate part, 2...Insulating layer and outermost layer part, 3...Conducting part between outermost layer and inner layer only.
Claims (1)
け、その絶縁層の外側と上記プリント基板の外層
とを導通させ、新たにできあがつた最外層からは
、その内側の層へのみしか貫通する導通穴が存在
せず、かつその導通孔と表示実装部品はんだ付け
部が重なつていることを特徴とするプリント配線
基板。 An insulating layer is provided on the outermost layer of a multilayer printed wiring board, the outside of the insulating layer is electrically connected to the outer layer of the printed circuit board, and the newly formed outermost layer penetrates only to the inner layer. A printed wiring board characterized in that there is no conductive hole, and the conductive hole overlaps a soldered part of a display mounting component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11698990U JPH0472680U (en) | 1990-11-06 | 1990-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11698990U JPH0472680U (en) | 1990-11-06 | 1990-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472680U true JPH0472680U (en) | 1992-06-26 |
Family
ID=31864854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11698990U Pending JPH0472680U (en) | 1990-11-06 | 1990-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472680U (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622697A (en) * | 1985-06-26 | 1987-01-08 | ゼネラル セラミツクス インコ−ポレイテツド | Multilayer ceramic circuit board and making thereof |
| JPS6226896A (en) * | 1985-07-26 | 1987-02-04 | 日本電気株式会社 | Electronic circuit package |
| JPS6337693A (en) * | 1986-08-01 | 1988-02-18 | 日本電気株式会社 | Manufacture of multilayer interconnection board |
| JPS6480524A (en) * | 1987-09-24 | 1989-03-27 | Matsushita Electric Works Ltd | Multi-layer printed wiring board |
| JPH01100996A (en) * | 1987-10-14 | 1989-04-19 | Canon Inc | Multilayer printed wiring board |
-
1990
- 1990-11-06 JP JP11698990U patent/JPH0472680U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622697A (en) * | 1985-06-26 | 1987-01-08 | ゼネラル セラミツクス インコ−ポレイテツド | Multilayer ceramic circuit board and making thereof |
| JPS6226896A (en) * | 1985-07-26 | 1987-02-04 | 日本電気株式会社 | Electronic circuit package |
| JPS6337693A (en) * | 1986-08-01 | 1988-02-18 | 日本電気株式会社 | Manufacture of multilayer interconnection board |
| JPS6480524A (en) * | 1987-09-24 | 1989-03-27 | Matsushita Electric Works Ltd | Multi-layer printed wiring board |
| JPH01100996A (en) * | 1987-10-14 | 1989-04-19 | Canon Inc | Multilayer printed wiring board |
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