JPH0459976U - - Google Patents
Info
- Publication number
- JPH0459976U JPH0459976U JP10326790U JP10326790U JPH0459976U JP H0459976 U JPH0459976 U JP H0459976U JP 10326790 U JP10326790 U JP 10326790U JP 10326790 U JP10326790 U JP 10326790U JP H0459976 U JPH0459976 U JP H0459976U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- conductor circuit
- circuit
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 239000012787 coverlay film Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は、本考案のフレキシブル印刷配線基板
と印刷配線基板との接続構造を示す断面図、第２
図は従来の接続構造を示す断面図である。
主な図番の説明、８……印刷配線基板、９，１
２……導体回路、１０……フレキシブル印刷配線
基板、１１……ベースフイルム、１２ａ……接続
用導体回路部、１３……カバーレイフイルム、１
４……半田、１５……半田層。
FIG. 1 is a sectional view showing the connection structure between the flexible printed wiring board and the printed wiring board of the present invention, and FIG.
The figure is a sectional view showing a conventional connection structure. Explanation of main drawing numbers, 8...Printed wiring board, 9, 1
2... Conductor circuit, 10 ... Flexible printed wiring board, 11... Base film, 12a... Connection conductor circuit section, 13... Cover lay film, 1
4...Solder, 15...Solder layer.
Claims (1)
設けられているとともに該導体回路上にカバーレ
イフイルムが形成されているフレキシブル印刷配
線基板において、該フレキシブル印刷配線基板の
端部に他の印刷配線基板に設けられている導体回
路と半田付にて接続される接続用導体回路部を設
けるとともに前記カバーレイフイルムを前記接続
用導体回路部が表出するように、且つ前記印刷配
線基板の導体回路と半田付される部分より離間し
た位置まで形成し、表出された接続用導体回路部
に半田メツキをしたことを特徴とするフレキシブ
ル印刷配線基板。 In a flexible printed wiring board in which a conductive circuit is provided on a flexible base film and a coverlay film is formed on the conductive circuit, an end portion of the flexible printed wiring board is provided with another printed wiring board. A connecting conductor circuit part is provided to be connected by soldering to a conductor circuit provided on the printed wiring board, and the cover lay film is arranged so that the connecting conductor circuit part is exposed and connected to the conductor circuit of the printed wiring board. A flexible printed wiring board characterized in that the printed circuit board is formed to a position spaced apart from the part to be soldered, and the exposed connection conductor circuit part is soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990103267U JPH0735409Y2 (en) | 1990-09-28 | 1990-09-28 | Flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990103267U JPH0735409Y2 (en) | 1990-09-28 | 1990-09-28 | Flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0459976U true JPH0459976U (en) | 1992-05-22 |
| JPH0735409Y2 JPH0735409Y2 (en) | 1995-08-09 |
Family
ID=31848076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990103267U Expired - Lifetime JPH0735409Y2 (en) | 1990-09-28 | 1990-09-28 | Flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0735409Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135770U (en) * | 1988-03-08 | 1989-09-18 |
-
1990
- 1990-09-28 JP JP1990103267U patent/JPH0735409Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135770U (en) * | 1988-03-08 | 1989-09-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0735409Y2 (en) | 1995-08-09 |