JPH03128967U - - Google Patents
Info
- Publication number
- JPH03128967U JPH03128967U JP3774090U JP3774090U JPH03128967U JP H03128967 U JPH03128967 U JP H03128967U JP 3774090 U JP3774090 U JP 3774090U JP 3774090 U JP3774090 U JP 3774090U JP H03128967 U JPH03128967 U JP H03128967U
- Authority
- JP
- Japan
- Prior art keywords
- land
- wiring board
- printed wiring
- soldering
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のプリント配線板の要部を示す
斜視図である。第２図は本考案のプリント配線板
を示す斜視図である。第３図ははんだの付着特性
を示す説明図である。第４図は従来のランドに電
気接片をはんだ付けした状態を示す説明図である
。第５図はランドの従来例を示す斜視図である。
２……はんだ、３，１２，１３……ランド、１
０……プリント基板、２０，２１……銅板、２２
……分離帯。
FIG. 1 is a perspective view showing the main parts of the printed wiring board of the present invention. FIG. 2 is a perspective view showing the printed wiring board of the present invention. FIG. 3 is an explanatory diagram showing the adhesion characteristics of solder. FIG. 4 is an explanatory diagram showing a state in which an electric contact piece is soldered to a conventional land. FIG. 5 is a perspective view showing a conventional example of a land. 2...Solder, 3,12,13...Land, 1
0...Printed circuit board, 20, 21...Copper plate, 22
...Separation zone.
Claims (1)
線板において、前記ランドに湾曲した帯状の切欠
きを形成したことを特徴とするプリント配線板。 1. A printed wiring board on which a land for soldering is formed, characterized in that a curved band-shaped notch is formed in the land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3774090U JPH03128967U (en) | 1990-04-09 | 1990-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3774090U JPH03128967U (en) | 1990-04-09 | 1990-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03128967U true JPH03128967U (en) | 1991-12-25 |
Family
ID=31545123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3774090U Pending JPH03128967U (en) | 1990-04-09 | 1990-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03128967U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009111410A (en) * | 2008-12-26 | 2009-05-21 | Panasonic Corp | Module |
-
1990
- 1990-04-09 JP JP3774090U patent/JPH03128967U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009111410A (en) * | 2008-12-26 | 2009-05-21 | Panasonic Corp | Module |