JPS6190276U - - Google Patents
Info
- Publication number
- JPS6190276U JPS6190276U JP17591884U JP17591884U JPS6190276U JP S6190276 U JPS6190276 U JP S6190276U JP 17591884 U JP17591884 U JP 17591884U JP 17591884 U JP17591884 U JP 17591884U JP S6190276 U JPS6190276 U JP S6190276U
- Authority
- JP
- Japan
- Prior art keywords
- land
- component soldering
- soldering land
- printed wiring
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例におけるフレキシブ
ルプリント配線装置の斜視図、第２図はそれの断
面図、第３図は従来のフレキシブルプリント配線
装置の平面図である。
１…フレキシブルプリント配線基板、２…部品
半田付ランド、３…銅箔（部品半田付ランド側）
、４…銅箔ランド（部品半田付ランド裏面）、５
…半田。
FIG. 1 is a perspective view of a flexible printed wiring device according to an embodiment of the present invention, FIG. 2 is a sectional view thereof, and FIG. 3 is a plan view of a conventional flexible printed wiring device. 1...Flexible printed wiring board, 2...Component soldering land, 3...Copper foil (component soldering land side)
, 4...Copper foil land (back side of component soldering land), 5
…solder.
Claims (1)
付ランドと同形状の銅箔ランドを配置したフレキ
シブルプリント配線装置。 A flexible printed wiring device in which a copper foil land having the same shape as the component soldering land is arranged at the same position on the back side of the component soldering land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17591884U JPS6190276U (en) | 1984-11-20 | 1984-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17591884U JPS6190276U (en) | 1984-11-20 | 1984-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6190276U true JPS6190276U (en) | 1986-06-12 |
Family
ID=30733519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17591884U Pending JPS6190276U (en) | 1984-11-20 | 1984-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6190276U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS588974B2 (en) * | 1981-03-20 | 1983-02-18 | エクセロ コ−ポレ−シヨン | Polyurethane molding method using siloxane internal mold release agent |
-
1984
- 1984-11-20 JP JP17591884U patent/JPS6190276U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS588974B2 (en) * | 1981-03-20 | 1983-02-18 | エクセロ コ−ポレ−シヨン | Polyurethane molding method using siloxane internal mold release agent |