JPS63201371U - - Google Patents
Info
- Publication number
- JPS63201371U JPS63201371U JP9372087U JP9372087U JPS63201371U JP S63201371 U JPS63201371 U JP S63201371U JP 9372087 U JP9372087 U JP 9372087U JP 9372087 U JP9372087 U JP 9372087U JP S63201371 U JPS63201371 U JP S63201371U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- fixing
- pads
- fixing structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の原理平面図、第２図は本考案
による一実施例の説明図で、ａは斜視図、ｂは要
部断面図、第３図は従来の説明図で、ａは斜視図
、ｂは要部断面図を示す。
図において、１は第１のプリント基板、２は第
２のプリント基板、３，４は固定パツド、５は半
田、１Ａは表面を示す。
Fig. 1 is a plan view of the principle of the present invention, Fig. 2 is an explanatory diagram of an embodiment according to the present invention, a is a perspective view, b is a sectional view of the main part, and Fig. 3 is a conventional explanatory diagram; A perspective view, b shows a sectional view of a main part. In the figure, 1 is a first printed circuit board, 2 is a second printed circuit board, 3 and 4 are fixing pads, 5 is solder, and 1A is a surface.
Claims (1)
板１の表面１Ａに重ねられる可撓性の第２のプリ
ント基板２とを備え、該第１のプリント基板１の
所定箇所に該第２のプリント基板２を固着するプ
リント基板の固着構造であつて、 前記第１のプリント基板１と前記第２のプリン
ト基板２とのそれぞれに固定パツド３，４を設け
、かつ、該固定パツド３，４の互いが半田５によ
る半田付けされて成ることを特徴とするプリント
基板の固着構造。[Claims for Utility Model Registration] The first printed circuit board 1 comprises a first printed circuit board 1 and a flexible second printed circuit board 2 superimposed on the surface 1A of the first printed circuit board 1. This is a printed circuit board fixing structure for fixing the second printed circuit board 2 to a predetermined location, wherein fixing pads 3 and 4 are provided on each of the first printed circuit board 1 and the second printed circuit board 2, A printed circuit board fixing structure characterized in that the fixing pads 3 and 4 are soldered to each other with solder 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9372087U JPS63201371U (en) | 1987-06-18 | 1987-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9372087U JPS63201371U (en) | 1987-06-18 | 1987-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201371U true JPS63201371U (en) | 1988-12-26 |
Family
ID=30956534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9372087U Pending JPS63201371U (en) | 1987-06-18 | 1987-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201371U (en) |
-
1987
- 1987-06-18 JP JP9372087U patent/JPS63201371U/ja active Pending