JPS6359371U - - Google Patents
Info
- Publication number
- JPS6359371U JPS6359371U JP15462986U JP15462986U JPS6359371U JP S6359371 U JPS6359371 U JP S6359371U JP 15462986 U JP15462986 U JP 15462986U JP 15462986 U JP15462986 U JP 15462986U JP S6359371 U JPS6359371 U JP S6359371U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- copper foil
- foil pattern
- pattern provided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第1図は本考案の一実施例を示す斜視図、第2
図はその断面図、第3図は従来例を示す斜視図、
第4図はその断面図である。
図において、1は第1のプリント基板、2は銅
箔パターン、4は第2のプリント基板、5は銅箔
パターン、7は半田、8は溝である。なお、図中
同一符号は同一または相当部分を示す。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a cross-sectional view, and Figure 3 is a perspective view showing a conventional example.
FIG. 4 is a sectional view thereof. In the figure, 1 is a first printed circuit board, 2 is a copper foil pattern, 4 is a second printed circuit board, 5 is a copper foil pattern, 7 is solder, and 8 is a groove. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
ンに相応して表面配置された第2のプリント基板
上に設けられた銅箔パターンを上記第1のプリン
ト基板上の銅箔パターンに半田付け接続して成る
プリント基板接続構造において、上記第2のプリ
ント基板の銅箔パターンの下部絶縁を一部除去し
たことを特徴とする取付構造。 A copper foil pattern provided on a second printed circuit board whose surface is arranged in a manner corresponding to the copper foil pattern provided on the first printed circuit board is soldered and connected to the copper foil pattern on the first printed circuit board. A printed circuit board connection structure comprising: a mounting structure in which a portion of the lower insulation of the copper foil pattern of the second printed circuit board is removed;
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15462986U JPS6359371U (en) | 1986-10-07 | 1986-10-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15462986U JPS6359371U (en) | 1986-10-07 | 1986-10-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6359371U true JPS6359371U (en) | 1988-04-20 |
Family
ID=31074597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15462986U Pending JPS6359371U (en) | 1986-10-07 | 1986-10-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6359371U (en) |
-
1986
- 1986-10-07 JP JP15462986U patent/JPS6359371U/ja active Pending