JPS6395276U - - Google Patents
Info
- Publication number
- JPS6395276U JPS6395276U JP19110586U JP19110586U JPS6395276U JP S6395276 U JPS6395276 U JP S6395276U JP 19110586 U JP19110586 U JP 19110586U JP 19110586 U JP19110586 U JP 19110586U JP S6395276 U JPS6395276 U JP S6395276U
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- printed circuit
- attached
- circuit board
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
第１図は本考案になるプリント基板の一実施例
を示すものでその一部を示す外観斜視図、第２図
は第１図の―線上における断面図、第３図は
従来のプリント基板の一部を示す外観斜視図、第
４図は第３図の―線上における断面図である
。
１１……プリント基板、１２……絶縁基板、１
３……プリント回路パターン、１４……電子部品
接続端子、１５……第１のクリーム半田、１６…
…第２のクリーム半田。
Figure 1 shows an embodiment of the printed circuit board according to the present invention, and is a partial external perspective view, Figure 2 is a sectional view taken along the line - - in Figure 1, and Figure 3 is a conventional printed circuit board. FIG. 4 is a perspective view of a partial appearance, and FIG. 4 is a cross-sectional view taken along the line -- in FIG. 11...Printed board, 12...Insulating board, 1
3... Printed circuit pattern, 14... Electronic component connection terminal, 15... First cream solder, 16...
...Second cream solder.
Claims (1)
が形成され、このプリント回路パターンの電極部
分に第１のクリーム半田が付着されるプリント基
板において、前記第１のクリーム半田が付着され
る部分の外周位置部分に予め前記第１のクリーム
半田の粘度より高い粘度を有する第２のクリーム
半田を付着しておき、前記第１のクリーム半田が
付着されることを特徴とするプリント基板。 (2) 第２のクリーム半田の高さは、第１のクリ
ーム半田の略２分の１の高さである実用新案登録
請求の範囲第１項記載のプリント基板。[Claims for Utility Model Registration] (1) A printed circuit board in which a printed circuit pattern of copper foil is formed on an insulating substrate, and a first cream solder is attached to electrode portions of the printed circuit pattern, A second cream solder having a viscosity higher than the viscosity of the first cream solder is attached in advance to an outer circumferential position of the part to which the cream solder is attached, and the first cream solder is attached. printed circuit board. (2) The printed circuit board according to claim 1, wherein the height of the second cream solder is approximately half the height of the first cream solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19110586U JPS6395276U (en) | 1986-12-11 | 1986-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19110586U JPS6395276U (en) | 1986-12-11 | 1986-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6395276U true JPS6395276U (en) | 1988-06-20 |
Family
ID=31144942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19110586U Pending JPS6395276U (en) | 1986-12-11 | 1986-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6395276U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021077790A (en) * | 2019-11-11 | 2021-05-20 | 三菱電機株式会社 | Manufacturing method of semiconductor device |
-
1986
- 1986-12-11 JP JP19110586U patent/JPS6395276U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021077790A (en) * | 2019-11-11 | 2021-05-20 | 三菱電機株式会社 | Manufacturing method of semiconductor device |