JPS6240865U - - Google Patents
Info
- Publication number
- JPS6240865U JPS6240865U JP13076085U JP13076085U JPS6240865U JP S6240865 U JPS6240865 U JP S6240865U JP 13076085 U JP13076085 U JP 13076085U JP 13076085 U JP13076085 U JP 13076085U JP S6240865 U JPS6240865 U JP S6240865U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- sides
- connection structure
- pattern formed
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000006071 cream Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す断面図であつ
て、ａ図は半田付前を示す図、ｂ図は半田付後を
示す図、第２図は本考案一実施例の変形例を示す
断面図であつて、ａ図は半田付前を示す図、ｂ図
は半田付後を示す図である。
１…回路基板、２…回路パターン、３ａ…リー
ド端子、４…クリーム半田、５…半田。
Fig. 1 is a sectional view showing an embodiment of the present invention, in which Fig. a shows the state before soldering, Fig. b shows the state after soldering, and Fig. 2 shows a modification of the embodiment of the present invention. FIG. 2 is a cross-sectional view showing the structure, in which figure a shows the state before soldering, and figure b shows the state after soldering. 1... Circuit board, 2... Circuit pattern, 3a... Lead terminal, 4... Cream solder, 5... Solder.
Claims (1)
路基板の各面間を電気的に接続する回路基板接続
構造において、前記回路基板の所定位置にリード
端子付電気部品を装着し、前記リード端子を両面
に形成された夫々の回路パターンと電気的に接続
したことを特徴とする回路基板接続構造。 In a circuit board connection structure that electrically connects each side of a circuit board having a predetermined circuit pattern formed on both sides, an electrical component with lead terminals is attached to a predetermined position of the circuit board, and the lead terminals are connected to each other on both sides. A circuit board connection structure characterized in that it is electrically connected to each circuit pattern formed on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13076085U JPS6240865U (en) | 1985-08-27 | 1985-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13076085U JPS6240865U (en) | 1985-08-27 | 1985-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240865U true JPS6240865U (en) | 1987-03-11 |
Family
ID=31028569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13076085U Pending JPS6240865U (en) | 1985-08-27 | 1985-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240865U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55108792A (en) * | 1979-02-14 | 1980-08-21 | Matsushita Electric Ind Co Ltd | Method of fabricating circuit board |
| JPS5828894A (en) * | 1981-08-12 | 1983-02-19 | 松下電器産業株式会社 | Method of connecting both-side printed circuit board |
| JPS61191095A (en) * | 1985-02-20 | 1986-08-25 | ソニー株式会社 | Circuit apparatus and manufacture thereof |
-
1985
- 1985-08-27 JP JP13076085U patent/JPS6240865U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55108792A (en) * | 1979-02-14 | 1980-08-21 | Matsushita Electric Ind Co Ltd | Method of fabricating circuit board |
| JPS5828894A (en) * | 1981-08-12 | 1983-02-19 | 松下電器産業株式会社 | Method of connecting both-side printed circuit board |
| JPS61191095A (en) * | 1985-02-20 | 1986-08-25 | ソニー株式会社 | Circuit apparatus and manufacture thereof |