JPS6387839U - - Google Patents
Info
- Publication number
- JPS6387839U JPS6387839U JP18304186U JP18304186U JPS6387839U JP S6387839 U JPS6387839 U JP S6387839U JP 18304186 U JP18304186 U JP 18304186U JP 18304186 U JP18304186 U JP 18304186U JP S6387839 U JPS6387839 U JP S6387839U
- Authority
- JP
- Japan
- Prior art keywords
- mold case
- circuit device
- enclosed
- stopper part
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は、本考案の印刷基板にリード端子を接
続した平面図である。第２図は、第１図をケース
に入れた場合の平面図ａと側面図ｂである。第３
図は、第２図をＰＷＢに実装した時の平面図であ
る。第４図、第５図は、従来のケースに入れた場
合の各平面図ａと側面図ｂを示す。
１……セラミツク基板、２……導電体、３……
はんだ、４，１４……ストツパー部、５，１５，
２５，３５，４５……リード端子、１６，２６，
３６，４６……ケース、２７……ＰＷＢ、３８，
４８……ケースの突出部又は突起部。
FIG. 1 is a plan view of lead terminals connected to the printed circuit board of the present invention. FIG. 2 is a plan view a and a side view b of the case shown in FIG. 1 when it is placed in a case. Third
The figure is a plan view when FIG. 2 is mounted on a PWB. FIGS. 4 and 5 show a plan view a and a side view b, respectively, when the device is placed in a conventional case. 1... Ceramic substrate, 2... Conductor, 3...
Solder, 4, 14...Stopper part, 5, 15,
25, 35, 45...Lead terminal, 16, 26,
36, 46...Case, 27...PWB, 38,
48... Protrusion or protrusion of the case.
Claims (1)
板にリード端子を取付け、モールドケースに封入
した混成集積回路装置において、リード端子のス
トツパー部をモールドケースより突出させた事を
特徴とする混成集積回路装置。 A hybrid integrated circuit device in which lead terminals are attached to a printed circuit board with an electric circuit formed on an insulating substrate and enclosed in a mold case, characterized in that the stopper part of the lead terminal protrudes from the mold case. circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18304186U JPS6387839U (en) | 1986-11-27 | 1986-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18304186U JPS6387839U (en) | 1986-11-27 | 1986-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6387839U true JPS6387839U (en) | 1988-06-08 |
Family
ID=31129408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18304186U Pending JPS6387839U (en) | 1986-11-27 | 1986-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6387839U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5176974A (en) * | 1974-12-27 | 1976-07-03 | Hitachi Ltd |
-
1986
- 1986-11-27 JP JP18304186U patent/JPS6387839U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5176974A (en) * | 1974-12-27 | 1976-07-03 | Hitachi Ltd |