JPS61201349U - - Google Patents
Info
- Publication number
- JPS61201349U JPS61201349U JP8485085U JP8485085U JPS61201349U JP S61201349 U JPS61201349 U JP S61201349U JP 8485085 U JP8485085 U JP 8485085U JP 8485085 U JP8485085 U JP 8485085U JP S61201349 U JPS61201349 U JP S61201349U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- integrated circuit
- circuit device
- hybrid integrated
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000013011 mating Effects 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
本考案の一実施例を実装した時の側面図、第３図
は従来例を示す斜視図、第４図は従来装置を実装
した時の側面図である。
１……混成集積回路装置、２……絶縁性支柱、
３……チツプ形セラミツクコンデンサ、４……集
積回路、５……リード、６……プリント板。
Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a side view when an embodiment of the invention is implemented, Fig. 3 is a perspective view of a conventional example, and Fig. 4 is a perspective view of a conventional device. It is a side view when it is mounted. 1... Hybrid integrated circuit device, 2... Insulating support,
3...Chip type ceramic capacitor, 4...Integrated circuit, 5...Lead, 6...Printed board.
Claims (1)
本体を実装させる相手方の基板とを一定間隔に保
持し、前記本体を相手方の基板に実装する混成集
積回路装置において、電気部品と基板とを一定間
隔に保持する絶縁性支柱を前記本体上にはんだ付
にて設けたことを特徴とする混成集積回路装置。 In a hybrid integrated circuit device in which an electrical component attached to a hybrid integrated circuit device main body and a mating board on which the main body is mounted are held at a constant interval, and the main body is mounted on the mating board, the electrical component and the board are held at a constant interval. 1. A hybrid integrated circuit device, characterized in that an insulating support for holding the device is provided on the main body by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8485085U JPS61201349U (en) | 1985-06-05 | 1985-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8485085U JPS61201349U (en) | 1985-06-05 | 1985-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61201349U true JPS61201349U (en) | 1986-12-17 |
Family
ID=30634707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8485085U Pending JPS61201349U (en) | 1985-06-05 | 1985-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61201349U (en) |
-
1985
- 1985-06-05 JP JP8485085U patent/JPS61201349U/ja active Pending