JPS62190374U - - Google Patents
Info
- Publication number
- JPS62190374U JPS62190374U JP8058686U JP8058686U JPS62190374U JP S62190374 U JPS62190374 U JP S62190374U JP 8058686 U JP8058686 U JP 8058686U JP 8058686 U JP8058686 U JP 8058686U JP S62190374 U JPS62190374 U JP S62190374U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- printed circuit
- groove
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案の電子部品の取付装置の要部断
面図、第2図は本考案の電子部品の要部拡大図、
第3図は従来の電子部品の取付装置の斜視図、第
4図は従来の電子部品の取付装置の要部断面図で
ある。
5……リード端子、5a……凹溝、6……プリ
ント基板、7……導体パターン。
FIG. 1 is a cross-sectional view of the main parts of the electronic component mounting device of the present invention, FIG. 2 is an enlarged view of the main parts of the electronic component of the present invention,
FIG. 3 is a perspective view of a conventional electronic component mounting device, and FIG. 4 is a sectional view of a main part of the conventional electronic component mounting device. 5...Lead terminal, 5a...Concave groove, 6...Printed circuit board, 7...Conductor pattern.
Claims (1)
リード端子と電気的に接続される導体パターンが
形成されたプリント基板とからなり、前記リード
端子のプリント基板と接触する面に凹溝を形成し
て、この凹溝に前記プリント基板の導体パターン
を嵌合させて取付けることを特徴とする電子部品
の取付装置。 It consists of an electronic component having a plurality of lead terminals and a printed circuit board on which a conductive pattern is formed to be electrically connected to the lead terminals, and a groove is formed on the surface of the lead terminal that contacts the printed circuit board. . An electronic component mounting device, characterized in that the electronic component is mounted by fitting the conductive pattern of the printed circuit board into the groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8058686U JPS62190374U (en) | 1986-05-26 | 1986-05-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8058686U JPS62190374U (en) | 1986-05-26 | 1986-05-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62190374U true JPS62190374U (en) | 1987-12-03 |
Family
ID=30931523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8058686U Pending JPS62190374U (en) | 1986-05-26 | 1986-05-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62190374U (en) |
-
1986
- 1986-05-26 JP JP8058686U patent/JPS62190374U/ja active Pending