JPH0317665U - - Google Patents
Info
- Publication number
- JPH0317665U JPH0317665U JP7737089U JP7737089U JPH0317665U JP H0317665 U JPH0317665 U JP H0317665U JP 7737089 U JP7737089 U JP 7737089U JP 7737089 U JP7737089 U JP 7737089U JP H0317665 U JPH0317665 U JP H0317665U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electronic components
- insulator
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例を示し、ａは斜視図ｂ
はプリント基板への実装状態を示す断面図、第２
図は従来例を示し、ａは斜視図ｂはａのＸ−Ｘ部
分の断面図、第３図は他の従来例の実装状態を示
す断面図である。
１…電子部品、１１…絶縁体、１２…端子、２
…プリント基板、２ａ…電極、２１…凹部、２１
ｂ…底面、３…ペースト状半田。
Fig. 1 shows an embodiment of the present invention, a is a perspective view b
is a cross-sectional view showing the mounting state on the printed circuit board, the second
The figure shows a conventional example, where a is a perspective view, b is a cross-sectional view taken along the line X--X of a, and FIG. 3 is a cross-sectional view showing the mounting state of another conventional example. 1...Electronic component, 11...Insulator, 12...Terminal, 2
...Printed circuit board, 2a...electrode, 21...recess, 21
b...bottom surface, 3...paste solder.
Claims (1)
ト基板への電子部品実装構造において、上記プリ
ント基板の電子部品取付位置に上記電子部品の絶
縁体の外形寸法よりも僅かに大きい凹部を形成し
、その凹部の底面に上記絶縁体の下面に配設され
た端子と半田接続される電極を配列したことを特
徴とするプリント基板への電子部品実装構造。 In a structure for mounting electronic components on a printed circuit board in which electronic components are surface mounted on a printed circuit board, a recess slightly larger than the outer dimensions of the insulator of the electronic component is formed at the electronic component mounting position of the printed circuit board, and the recess is 1. A structure for mounting electronic components on a printed circuit board, characterized in that electrodes are arranged on the bottom surface to be connected by solder to terminals arranged on the lower surface of the insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7737089U JPH0317665U (en) | 1989-06-30 | 1989-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7737089U JPH0317665U (en) | 1989-06-30 | 1989-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317665U true JPH0317665U (en) | 1991-02-21 |
Family
ID=31619693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7737089U Pending JPH0317665U (en) | 1989-06-30 | 1989-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317665U (en) |
-
1989
- 1989-06-30 JP JP7737089U patent/JPH0317665U/ja active Pending